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    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    1.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权
    多层陶瓷电容器及其制造方法

    公开(公告)号：US20150302989A1

    公开(公告)日：2015-10-22

    申请号：US14337017

    申请日：2014-07-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Woo Jin CHOI

    IPC: H01G2/14 ,  H01G4/248 ,  H01G4/12 ,  H01G4/30 ,  H01G4/012

    CPC classification number: H01G2/14 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor may include a capacitance forming layer including dielectric layers and internal electrodes disposed on the dielectric layers; a lower cover layer disposed below the capacitance forming layer; an upper cover layer disposed above the capacitance forming layer; and a plurality of crack inducing air gaps disposed in the lower cover layer.

    Abstract translation: 多层陶瓷电容器可以包括电容形成层，其包括设置在电介质层上的电介质层和内部电极; 设置在电容形成层下方的下覆盖层; 设置在电容形成层上方的上覆盖层; 以及设置在下覆盖层中的多个裂纹引起气隙。

    MULTILAYER ELECTRONIC COMPONENT
    2.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT 审中-公开

    公开(公告)号：US20180122578A1

    公开(公告)日：2018-05-03

    申请号：US15633236

    申请日：2017-06-26

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Woo Jin CHOI

    IPC: H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G7/02 ,  H01G2/06

    CPC classification number: H01G2/06 ,  H01G4/12 ,  H01G4/232 ,  H01G4/30 ,  H01G4/304 ,  H01G4/38

    Abstract: A multilayer electronic component includes a first capacitor including a first multilayer body having a structure in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked, a second capacitor including a second multilayer body disposed adjacent the first multilayer body, the second multilayer body connected to the first multilayer body in parallel, and the second multilayer body having a structure in which a plurality of internal electrodes and a plurality of dielectric layers are alternately stacked, a fixing member fixing the first and second multilayer bodies, a first lead terminal connected to a first end portion of the fixing member, and a second lead terminal connected to a second end portion of the fixing member.

    CAPACITOR COMPONENT
    4.
    发明申请
    CAPACITOR COMPONENT 审中-公开

    公开(公告)号：US20190189348A1

    公开(公告)日：2019-06-20

    申请号：US15973211

    申请日：2018-05-07

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Woo Jin CHOI ,  Young Ghyu AHN ,  Jong Duck KIM

    IPC: H01G4/232 ,  H01G4/224

    Abstract: A capacitor component includes: a body having a first main surface and a second main surface facing each other in a thickness direction and side surfaces facing each other in a length direction and connected to the first and second main surfaces, the body including a plurality of dielectric layers and a plurality of internal electrodes stacked in the thickness direction and alternately exposed through the side surfaces of the body with each of the plurality of dielectric layers interposed therebetween; and external electrodes disposed on the side surfaces and the second main surface of the body and electrically connected to the plurality of internal electrodes.

    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD FOR MOUNTING THE SAME
    5.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND CIRCUIT BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电容器和电路板安装相同

    公开(公告)号：US20150302991A1

    公开(公告)日：2015-10-22

    申请号：US14339129

    申请日：2014-07-23

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Woo Jin CHOI

    IPC: H01G4/236 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/06

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/232 ,  H05K1/182 ,  H05K1/183

    Abstract: A multilayer ceramic capacitor may include: a ceramic body in which dielectric layers having first via holes are stacked in a thickness direction; first internal electrodes having second via holes disposed in positions corresponding to those of the first via holes and exposed to at least one side surface of the ceramic body; second internal electrodes having third via holes disposed in positions corresponding to those of the first and second via holes; a via electrode passing through the first to third via holes to thereby be exposed to upper and lower surfaces of the ceramic body, and connected to the third via holes; and a first external electrode disposed on the at least one side surface of the ceramic body to be connected to a portion of the first internal electrode exposed to the exterior of the ceramic body.

    Abstract translation: 多层陶瓷电容器可以包括：陶瓷体，其中具有第一通孔的电介质层在厚度方向上堆叠; 第一内部电极，具有设置在与第一通孔相对应的位置并且暴露于陶瓷体的至少一个侧表面的第二通孔; 第二内部电极，其具有设置在与第一和第二通孔相对应的位置的第三通孔; 通孔，通过所述第一至第三通孔，从而暴露于所述陶瓷体的上表面和下表面，并连接到所述第三通孔; 以及第一外部电极，设置在所述陶瓷体的至少一个侧表面上，以连接到暴露于所述陶瓷体的外部的所述第一内部电极的一部分。

    PIEZOELECTRIC PACKAGE
    8.
    发明申请
    PIEZOELECTRIC PACKAGE 审中-公开
    压电封装

    公开(公告)号：US20150333729A1

    公开(公告)日：2015-11-19

    申请号：US14575910

    申请日：2014-12-18

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Woo Jin CHOI

    IPC: H03H9/17 ,  H03H9/13 ,  H03H9/10

    CPC classification number: H03H9/1021 ,  H03H9/0552 ,  H03H9/10 ,  H03H9/13 ,  H03H9/17

    Abstract: Disclosed herein is a piezoelectric package including: a body having a piezoelectric component mounted therein and having a lower surface electrode provided on a bottom surface thereof, the lower surface electrode being electrically connected to the piezoelectric component; a groove part formed on the bottom surface of the body; and a capacitor component provided in the groove part and electrically connected to the piezoelectric component.

    Abstract translation: 本发明公开了一种压电封装，包括：具有安装在其中的压电元件的主体，其底表面上设置有一个下表面电极，该下表面电极与该压电元件电连接; 形成在所述主体的底面上的槽部; 以及设置在所述槽部中并电连接到所述压电部件的电容器部件。

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