公开(公告)号：US20180204663A1

公开(公告)日：2018-07-19

申请号：US15728114

申请日：2017-10-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Eun LEE ,  Kwang Sun CHOI ,  Min Jeong KIM ,  Jin Ho KU

IPC: H01F27/28 ,  H01F27/255 ,  H01F41/04 ,  H01F41/02

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292 ,  H01F27/327 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/046 ,  H01F2017/002

Abstract: An inductor comprises an insulating substrate; a first internal coil portion disposed on one surface of the insulating substrate and a second internal coil portion disposed on the other surface of the insulating substrate opposed thereto; a via electrode penetrating through the insulating substrate to connect the first internal coil portion to the second internal coil portion; and a first via pad disposed on one surface of the insulating substrate and a second via pad disposed on the other surface of the insulating substrate, to cover the via electrode. Respective cross-sectional areas of an upper portion and a lower portion of the via electrode, in contact with the first via pad and the second via pad, are greater than a cross-sectional area of a central portion thereof. In addition, a method of manufacturing the inductor is provided.