公开(公告)号：US20150287515A1

公开(公告)日：2015-10-08

申请号：US14448594

申请日：2014-07-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Kwang Sun CHOI

IPC: H01F27/28 ,  H01F41/10 ,  H01F27/24 ,  H01F41/04

CPC classification number: H01F17/0013 ,  H01F17/0033 ,  H01F27/292 ,  H01F41/046 ,  H01F2017/0066 ,  Y10T29/4902

Abstract: A multilayer array electronic component may include: a ceramic body in which a plurality of non-magnetic layers are stacked; a plurality of internal coil parts in which internal coil patterns respectively disposed on the plurality of non-magnetic layers are connected to each other by a via electrode penetrating through the non-magnetic layer; and a plurality of input terminals connected to first lead-out portions of the plurality of internal coil parts, respectively, and a plurality of output terminals connected to second lead-out portions of the plurality of internal coil parts, respectively. The plurality of internal coil parts may include first and second internal coil portions that are not electrically connected to each other, and formation directions of the first and second internal coil portions may be opposite to each other.

Abstract translation: 多层阵列电子部件可以包括：堆叠多个非磁性层的陶瓷体; 多个内部线圈部分，其中分别设置在多个非磁性层上的内部线圈图案通过穿过非磁性层的通孔电极彼此连接; 以及分别与所述多个内部线圈部的第一引出部连接的多个输入端，以及分别与所述多个内部线圈部的第二引出部连接的多个输出端子。 多个内部线圈部可以包括彼此不电连接的第一和第二内部线圈部，并且第一和第二内部线圈部的形成方向可以彼此相反。

公开(公告)号：US20190122810A1

公开(公告)日：2019-04-25

申请号：US16031216

申请日：2018-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seon Woo OH ,  Hyung Jin JEON ,  Jung Wook SEO ,  Young Seuck YOO ,  Byoung Hwa LEE ,  Kwang Sun CHOI ,  Kun Ho KOO

IPC: H01F27/29 ,  H01F27/32 ,  H01F27/06

Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.

公开(公告)号：US20180204663A1

公开(公告)日：2018-07-19

申请号：US15728114

申请日：2017-10-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jung Eun LEE ,  Kwang Sun CHOI ,  Min Jeong KIM ,  Jin Ho KU

IPC: H01F27/28 ,  H01F27/255 ,  H01F41/04 ,  H01F41/02

CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/255 ,  H01F27/292 ,  H01F27/327 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/046 ,  H01F2017/002

Abstract: An inductor comprises an insulating substrate; a first internal coil portion disposed on one surface of the insulating substrate and a second internal coil portion disposed on the other surface of the insulating substrate opposed thereto; a via electrode penetrating through the insulating substrate to connect the first internal coil portion to the second internal coil portion; and a first via pad disposed on one surface of the insulating substrate and a second via pad disposed on the other surface of the insulating substrate, to cover the via electrode. Respective cross-sectional areas of an upper portion and a lower portion of the via electrode, in contact with the first via pad and the second via pad, are greater than a cross-sectional area of a central portion thereof. In addition, a method of manufacturing the inductor is provided.