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公开(公告)号：US20230215639A1
公开(公告)日：2023-07-06
申请号：US17725857
申请日：2022-04-21
发明人： Chae Dong LEE , Og Soon KIM , Hye Won KIM , Jung Won PARK
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer electronic component includes: a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer; and external electrodes disposed on the body, wherein the external electrodes respectively include an electrode layer disposed on the body and connected to the plurality of internal electrodes and a conductive resin layer disposed on the electrode layer and including a first conductive particle, a second conductive particle, and a resin, wherein the first conductive particle is a Cu particle, the second conductive particle is a Cu particle having a surface on which Ag is disposed.
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公开(公告)号：US20230215649A1
公开(公告)日：2023-07-06
申请号：US17707384
申请日：2022-03-29
发明人： Hye Won KIM , Won Kuen OH , Chae Dong LEE , Og Soon KIM , Jung Won PARK
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
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公开(公告)号：US20240312718A1
公开(公告)日：2024-09-19
申请号：US18583094
申请日：2024-02-21
发明人： So Jung AN , Hyung Jong CHOI , Jung Won PARK , Yoo Jeong LEE , Kwang Yeun WON , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/12 , H01G4/2325
摘要： A multilayer electronic component includes a body including a dielectric layer and an internal electrode alternately disposed with the dielectric layer; and an external electrode disposed on the body, wherein the external electrode includes an electrode layer connected to the internal electrode and including Cu, a first plating portion disposed on the electrode layer, and a second plating portion disposed on the first plating portion, and wherein the first plating portion includes a Ni layer in contact with the electrode layer, and an intermetallic compound layer disposed on the Ni layer and including an intermetallic compound including at least one of Ni and Sn.
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公开(公告)号：US20240222030A1
公开(公告)日：2024-07-04
申请号：US18372870
申请日：2023-09-26
发明人： Yoo Jeong LEE , Kwang Yeun WON , Hyung Jong CHOI , So Jung AN , Jung Won PARK , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
摘要： A multilayer electronic component includes: a body including a dielectric layer and internal electrodes alternately positioned while having the dielectric layer interposed therebetween; and an external electrode positioned on the body. The external electrode includes an electrode layer connected to one or more of the internal electrodes and including copper (Cu), a first plating layer positioned on the electrode layer and including nickel (Ni), and a second plating layer positioned on the first plating layer and including nickel (Ni). An oxide including nickel (Ni) is positioned on a boundary surface between the first plating layer and the second plating layer. An average thickness of the first plating layer is smaller than an average thickness of the second plating layer.
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公开(公告)号：US20240203646A1
公开(公告)日：2024-06-20
申请号：US18382204
申请日：2023-10-20
发明人： Jung Won PARK , Hyung Jong CHOI , So Jung AN , Yoo Jeong LEE , Kwang Yeun WON , Woo Kyung SUNG , Byung Jun JEON , Chul Seung LEE
摘要： A multilayer electronic component according to an embodiment of the present disclosure includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body. The external electrode includes a first electrode layer connected to the internal electrode and including Cu, a second electrode layer partially disposed on the first electrode layer and including Ni, an intermediate layer disposed on the second electrode layer and in a region of the first electrode layer, in which the second electrode layer is not disposed, and including a metal oxide, and a first plating layer disposed on the intermediate layer and including Ni.
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