公开(公告)号：US20180114646A1

公开(公告)日：2018-04-26

申请号：US15851110

申请日：2017-12-21

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Soon-Ju LEE ,  Young-Ghyu AHN ,  Kyoung-Jin JUN ,  Sang-Soo PARK ,  So-Yeon SONG ,  Heung-Kil PARK

IPC: H01G4/30 ,  H01G4/248 ,  H01G4/12 ,  H01G4/012 ,  H05K3/34

CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/0085 ,  H01G4/232 ,  H05K3/3436 ,  Y02P70/613

Abstract: A multi-layer ceramic capacitor assembly includes a multi-layer ceramic capacitor comprising a laminate, the laminate having dielectric layers and internal electrodes laminated alternately therein, and external electrodes being electrically connected with the internal electrodes and disposed at end portions of the laminate; and an electrode-forming substrate coupled to the multi-layer ceramic capacitor and having through-holes disposed to correspond to the external electrodes.