公开(公告)号：US20180294299A1

公开(公告)日：2018-10-11

申请号：US15828993

申请日：2017-12-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Jung Hyun CHO ,  Min Keun KIM ,  Young Sik HUR ,  Tae Hee HAN

IPC: H01L27/146 ,  H01L27/32 ,  H01L23/00 ,  G02B5/20 ,  G06K9/00

Abstract: There are provided a fan-out sensor package and an optical fingerprint sensor module including the same. The fan-out sensor package includes: a connection member having a through-hole; an image sensor disposed in the through-hole of the connection member and having an active surface having connection pads disposed thereon and an inactive surface opposing the active surface; an encapsulant encapsulating at least portions of the connection member, the image sensor, and an optical lens; and a redistribution layer disposed on the connection member, the image sensor, and the optical lens. The connection member includes a wiring layer, and the redistribution layer electrically connects the wiring layer and the connection pads to each other.

公开(公告)号：US20220011899A1

公开(公告)日：2022-01-13

申请号：US17030762

申请日：2020-09-24

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Keun KIM ,  Ho Kwon YOON ,  Bang Chul KO ,  Joo Yul KO

IPC: G06F3/041 ,  G06F3/044 ,  G06F3/0488

Abstract: A touch sensing method includes: generating respective oscillation signals having a resonant frequency, the respective oscillation signals being changeable according to a plurality of touch inputs applied to a first touch switch unit and a second touch switch unit, formed in a housing of an electronic device; analyzing the applied plurality of touch inputs, based on a change in the resonant frequency of the generated oscillation signals; and discerning and sensing a type of a touch operation according to a pattern of the plurality of touch inputs, based on results of the analyzing of the applied plurality of touch inputs.

公开(公告)号：US20150369902A1

公开(公告)日：2015-12-24

申请号：US14623485

申请日：2015-02-16

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Keun KIM ,  Sang Hoon Kim

IPC: G01S5/04

CPC classification number: G01S5/04 ,  G01S5/14 ,  H04W4/023

Abstract: An amusement park management system may include at least one portable terminal apparatus including identification information and providing the identification information using a preset wireless communications scheme, a plurality of repeaters receiving the identification information provided from the portable terminal apparatus and detecting distance information of the portable terminal apparatus providing the identification information, and a server apparatus receiving the distance information provided from the plurality of repeaters and detecting coordinate information of the portable terminal apparatus providing the identification information.

Abstract translation: 游乐场管理系统可以包括至少一个包括识别信息的便携式终端设备，并且使用预设的无线通信方案提供识别信息，多个中继器接收从便携式终端设备提供的识别信息，并且检测便携式终端的距离信息 提供识别信息的装置，以及接收从多个中继器提供的距离信息并检测提供识别信息的便携式终端装置的坐标信息的服务器装置。

公开(公告)号：US20190181172A1

公开(公告)日：2019-06-13

申请号：US15958625

申请日：2018-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jong Rok KIM ,  Yong Ho BAEK ,  Jung Hyun CHO ,  Min Keun KIM ,  Jung Chul GONG ,  Young Sik HUR

IPC: H01L27/146 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31

Abstract: A fan-out sensor package includes: an image sensor chip including an integrated circuit (IC) for an image sensor having a first surface having first connection pads disposed thereon, a second surface opposing the first surface and having second connection pads disposed thereon, and through-silicon-vias (TSVs) penetrating between the first surface and the second surface and electrically connecting the first and second connection pads to each other and an optical portion disposed on the first surface of the IC for an image sensor and having a plurality of lens layers; an encapsulant covering at least portions of the second surface of the IC for an image sensor; a redistribution layer disposed on the encapsulant; and vias penetrating through at least portions of the encapsulant and electrically connecting the redistribution layer and the second connection pads to each other.

公开(公告)号：US20180307890A1

公开(公告)日：2018-10-25

申请号：US15922348

申请日：2018-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Min Keun KIM ,  Young Sik HUR ,  Yong Ho BAEK ,  Tae Hee HAN

IPC: G06K9/00 ,  H01L23/31 ,  H01L23/498

CPC classification number: G06K9/00053 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49816 ,  H01L2224/73204 ,  H05K1/185 ,  H05K2201/10 ,  H05K2201/10151

Abstract: A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.