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公开(公告)号：US20230292439A1
公开(公告)日：2023-09-14
申请号：US17954603
申请日：2022-09-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Gopal GARG , Jung Hyun CHO , Yong Ho BAEK
Abstract: A printed circuit board includes a substrate structure including a first insulating material, a plurality of first wiring layers disposed on or in the first insulating material, and a plurality of first via layers disposed in the first insulating material; and an interconnect structure including a second insulating material, a plurality of second wiring layers disposed on or in the second insulating material, and one or more second via layers disposed in the second insulating material. The interconnect structure is disposed on an upper side of the substrate structure. The interconnect structure includes first and second connection regions. The first and second connection regions are spaced apart from each other.
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公开(公告)号：US20180286770A1
公开(公告)日：2018-10-04
申请号：US16000200
申请日：2018-06-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Ho BAEK , Jung Hyun CHO , Jae Hoon CHOI
IPC: H01L21/66 , H01L23/00 , H01L21/56 , H01L23/31 , H01L23/522
Abstract: Aboard for an electronic component package includes a wiring part on which an electronic component is disposed, wherein the wiring part includes an insulating layer, a signal transferring wiring electrically connected to the electronic component, and an electrical testing wiring electrically disconnected from the electronic component, and the electrical testing wiring includes conductive patterns formed on both surfaces of the wiring part, and conductive vias electrically connecting the conductive patterns to each other.
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3.发明申请PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT MODULE 审中-公开印刷电路板及其制造方法和电子元件模块公开(公告)号：US20160143137A1
公开(公告)日：2016-05-19
申请号：US14878496
申请日：2015-10-08
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Yong Ho BAEK , Jung Hyun CHO , Young Gwan KO , Chang Bae LEE
CPC classification number: H05K3/4694 , H01L21/4857 , H01L21/486 , H01L23/5383 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H05K3/4682 , H05K2201/10522 , H05K2201/10674
Abstract: There are provided a printed circuit board, a method of manufacturing the same, and an electronic component module. The printed circuit board comprises a first circuit layer; a first insulating layer formed to cover a portion or all of the first circuit layer; a second circuit layer formed on the first insulating layer; a second insulating layer formed on an overall surface of the board so as to cover the first circuit layer and the second circuit layer; and a third circuit layer formed in the second insulating layer. The second circuit layer has a circuit pattern of a fine pitch as compared to the first circuit layer and the third circuit layer.
Abstract translation: 提供了印刷电路板，其制造方法和电子部件模块。 印刷电路板包括第一电路层; 形成为覆盖所述第一电路层的一部分或全部的第一绝缘层; 形成在所述第一绝缘层上的第二电路层; 形成在所述基板的整个表面上以覆盖所述第一电路层和所述第二电路层的第二绝缘层; 以及形成在所述第二绝缘层中的第三电路层。 与第一电路层和第三电路层相比，第二电路层具有精细间距的电路图案。
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公开(公告)号：US20160135289A1
公开(公告)日：2016-05-12
申请号：US14875241
申请日：2015-10-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Suk Hyeon CHO , Yoong OH , Young Gwan KO , Yong Ho BAEK , Young Kuk KO
CPC classification number: H05K1/0271 , H01L2224/16227 , H01L2924/15313 , H01L2924/15788 , H05K1/038 , H05K1/115 , H05K1/181 , H05K3/002 , H05K3/0029 , H05K3/0047 , H05K3/0052 , H05K3/429 , H05K3/4605 , H05K2201/0187 , H05K2201/0195 , H05K2201/0909 , H05K2201/09536 , H05K2201/09581 , H05K2201/09827 , H05K2201/09854 , H05K2201/10674
Abstract: There are provided a printed circuit board and a method of manufacturing the same. The printed circuit board include a glass plate, an insulating member penetrating through the glass plate, insulating layers disposed on a first surface and a second surface of the glass plate, and a via through the insulating member.
Abstract translation: 提供了一种印刷电路板及其制造方法。 印刷电路板包括玻璃板，穿透玻璃板的绝缘构件，设置在玻璃板的第一表面和第二表面上的绝缘层，以及通过绝缘构件的通孔。
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公开(公告)号：US20160021744A1
公开(公告)日：2016-01-21
申请号：US14735870
申请日：2015-06-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Yong Ho BAEK , Young Gwan KO , Jung Hyun CHO , Jae Ean LEE , Jae Hoon CHOI , Jung Hyun PARK
CPC classification number: H05K1/113 , H01L21/4857 , H01L23/49811 , H01L23/49822 , H01L2924/0002 , H05K3/205 , H05K3/4007 , H05K3/4682 , H05K2201/0367 , H05K2201/09563 , H01L2924/00
Abstract: A printed circuit board includes a first circuit pattern embedded in an insulating layer so that an upper surface of the first circuit pattern is exposed to one surface of the insulating layer, a coupling pad embedded in the insulating layer to come into contact with a lower surface of the first circuit pattern, and a bump pad formed on the upper surface of the first circuit pattern to protrude from one surface of the insulating layer.
Abstract translation: 印刷电路板包括嵌入在绝缘层中的第一电路图案，使得第一电路图案的上表面暴露于绝缘层的一个表面，嵌入在绝缘层中以与下表面接触的耦合垫 以及形成在第一电路图案的上表面上以从绝缘层的一个表面突出的凸块焊盘。
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Patent Agency Ranking
公开(公告)号：US20200214135A1
公开(公告)日：2020-07-02
申请号：US16812640
申请日：2020-03-09
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Jung Hyun PARK , Yong Ho BAEK , Jae Hoon CHOI
IPC: H05K1/18
Abstract: There is provided a printed circuit board including: a first insulating layer; a first circuit pattern formed on a first surface of the first insulating layer; an adhesive layer provided on a second surface of the first insulating layer; and an electronic component disposed on the adhesive layer and enclosed by the first insulating layer and a second insulating layer formed on the first insulating layer.
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公开(公告)号：US20190229055A1
公开(公告)日：2019-07-25
申请号：US16107727
申请日：2018-08-21
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Won Wook SO , Jin Seon PARK , Young Sik HUR , Yong Ho BAEK
IPC: H01L23/522 , H01L23/00 , H01L21/56
Abstract: A fan-out sensor package includes: a first semiconductor chip module including a first connection member having a first through-hole and a first wiring layer, a first semiconductor chip disposed in the first through-hole and having an active surface on which a sensing region and first connection pads are disposed, and an encapsulant encapsulating at least portions of the first connection member and the first semiconductor chip and filling at least portions of the first through-hole; a redistribution module having a second through-hole exposing at least a portion of the sensing region and including a redistribution layer; and electrical connection structures electrically connecting the first wiring layer and the first connection pads to the redistribution layer.
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公开(公告)号：US20190198486A1
公开(公告)日：2019-06-27
申请号：US15969359
申请日：2018-05-02
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Byoung Chan KIM , Yong Ho BAEK , Moon Il KIM , Young Sik HUR , Tae Hee HAN
IPC: H01L25/10 , H01L23/31 , H01L23/00 , H01L23/498 , H01L25/065
CPC classification number: H01L25/105 , H01L23/3121 , H01L23/49811 , H01L23/49822 , H01L24/16 , H01L25/0652 , H01L27/108 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2225/1058 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2924/00
Abstract: A fan-out semiconductor package includes first and second structures. The first structure includes a first semiconductor chip, a first encapsulant, and a connection member. The second structure includes a second semiconductor chip, a second encapsulant, and conductive bumps. The first and second structures are disposed so that active surfaces of the first and second semiconductor chips face each other. The conductive bumps are electrically connected to a redistribution layer, and connection pads of the first and second semiconductor chips are connected to each other through the redistribution layer in a signal manner. Signal transmission times between one point of the redistribution layer and connection pads of each of the first and second semiconductor chips are substantially the same as each other.
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公开(公告)号：US20190164863A1
公开(公告)日：2019-05-30
申请号：US16000094
申请日：2018-06-05
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Jung Hyun CHO , Young Sik HUR , Yong Ho BAEK
Abstract: A fan-out semiconductor package includes a first connection member having a through-hole, a semiconductor chip disposed in the through-hole and including an active surface having connection pads disposed thereon and an inactive surface opposing the active surface, a second connection member disposed on the active surface of the semiconductor chip and including a redistribution layer electrically connected to the semiconductor chip, and an encapsulant encapsulating the semiconductor chip and having a cavity disposed above the inactive surface of the semiconductor chip.
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公开(公告)号：US20190027804A1
公开(公告)日：2019-01-24
申请号：US15958489
申请日：2018-04-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Doo Il KIM , Yong Ho BAEK , Young Sik HUR , Sung Yong AN
Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to the at least one wiring layer; and a plurality of antenna cells each disposed on a second surface of the connection member. Each of the plurality of antenna cells includes an antenna member configured to transmit or receive a radio frequency (RF) signal, a feed via having one end electrically connected to the antenna member and the other end electrically connected to a corresponding wire of the at least one wiring layer, a dielectric layer surrounding side surfaces of the feed via and having a height greater than that of the at least one insulating layer, and a plating member surrounding side surfaces of the dielectric layer.
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