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公开(公告)号：US20240203643A1
公开(公告)日：2024-06-20
申请号：US18416983
申请日：2024-01-19
CPC分类号： H01G2/06 , H01G4/008 , H01G4/1227 , H01G4/2325 , H01G4/248 , H01G4/30
摘要： An electronic component includes an electronic element and an interposer board. The electronic element includes a multilayer body and external electrodes at a pair of multilayer body end surfaces of the multilayer body and connected to internal electrode layers. The interposer board includes board end surfaces, board side surfaces orthogonal to the board end surfaces, and board main surfaces orthogonal to the board end surfaces and the board side surfaces. One of the board main surfaces is located in a vicinity of the electronic element and joined with one of the multilayer body main surfaces in a vicinity of the interposer board. The interposer board is an alumina board. A mark portion is provided on one of the board main surfaces.
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公开(公告)号：US11955281B2
公开(公告)日：2024-04-09
申请号：US17321977
申请日：2021-05-17
发明人： Jae Hoon Kim , Chang Hee Lee , Jea Hoon Lee , Hye Jin Kim , Yeo Ju Cho
摘要： An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.
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公开(公告)号：US20240072022A1
公开(公告)日：2024-02-29
申请号：US17899592
申请日：2022-08-30
发明人： Seng Kim Ye , Kelvin Tan Aik Boo , Hong Wan Ng , Chin Hui Chong
CPC分类号： H01L25/16 , H01G2/06 , H01G13/00 , H01L24/48 , H01L24/49 , H01L25/0657 , H01L25/18 , H01L24/16 , H01L2224/16225 , H01L2224/48106 , H01L2224/48145 , H01L2224/48195 , H01L2224/48227 , H01L2224/49175 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06562 , H01L2924/1431 , H01L2924/1434 , H01L2924/19041 , H01L2924/19105
摘要： Semiconductor devices, and related systems and methods, are disclosed herein. In some embodiments, the stacked semiconductor device includes a package substrate having an inner surface, a die stack carried by the inner surface, and a stacked capacitor device carried by the inner surface adjacent to the die stack. The die stack can include one or more semiconductor dies, each of which can be electrically coupled to the inner surface by one or more bond wires and/or solder structures. The stacked capacitor device can include a first capacitor having a lower surface attached to the inner surface of the package substrate, a interposer having a first side attached to an upper surface of the first capacitor, and a second capacitor attached to a second side of the interposer opposite the first side.
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公开(公告)号：US20240055184A1
公开(公告)日：2024-02-15
申请号：US18494499
申请日：2023-10-25
发明人： Manabu KANOU , Yuya KATO , Hiroyuki KOSHIKAWA , Michio SUZUKA
摘要： A capacitor of the present disclosure includes a first electrode, a second electrode, and a dielectric. The second electrode is disposed to face a principal surface of the first electrode. The dielectric is disposed between the first electrode and the second electrode. The dielectric is in contact with the first electrode and the second electrode. A surface of the second electrode extends, for example, parallel to a surface of the first electrode, the surfaces each being in contact with the dielectric. An electrical conductivity σx of the dielectric in a particular direction perpendicular to the principal surface and an electrical conductivity σy of the dielectric in a direction perpendicular to the particular direction satisfy a relation σx/σy≤0.01.
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公开(公告)号：US20230395322A1
公开(公告)日：2023-12-07
申请号：US18098284
申请日：2023-01-18
发明人： Soohwan Son , Mansu Byun
CPC分类号： H01G2/06 , H05K1/183 , H01G4/30 , H01G4/248 , H05K2201/10015
摘要： A multilayer ceramic capacitor mounted structure relates to a structure in which a multilayer ceramic capacitor is mounted on a circuit board through electrode pads. The multilayer ceramic capacitor may include: a ceramic body including a plurality of dielectric layers stacked with a length, a width, and a thickness of a preset size; external electrodes spaced apart from each other along a longitudinal direction of the ceramic body, each of the external electrodes being disposed on at least opposite sides in a width direction of the ceramic body; and a plurality of internal electrodes alternately stacked with the dielectric layers therebetween and respectively connected to the external electrodes in the ceramic body, and edges of the external electrodes may be aligned with outer edges of the electrode pads or positioned at least more outwardly than the outer edges of the electrode pads, at opposite ends along the longitudinal direction of the ceramic body.
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公开(公告)号：US11749461B2
公开(公告)日：2023-09-05
申请号：US17489887
申请日：2021-09-30
CPC分类号： H01G4/30 , H01G2/06 , H01G4/2325 , H01G4/248
摘要： A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.
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公开(公告)号：US20230162925A1
公开(公告)日：2023-05-25
申请号：US18158736
申请日：2023-01-24
发明人： Hiroaki SATO
CPC分类号： H01G4/30 , H01G2/06 , H01G4/224 , H01G4/232 , H01G4/1227 , H05K1/181 , H05K3/3442 , H05K2201/10015
摘要： A multi-layer ceramic electronic component includes: a ceramic body that includes internal electrodes laminated in a first direction, and a pair of main surfaces including a center region facing in the first direction; and a pair of external electrodes connected to the internal electrodes and facing each other in a second direction orthogonal to the first direction, a dimension of the ceramic body in the first direction being 1.1 times or more and 1.6 times or less a dimension of the ceramic body in a third direction orthogonal to the first direction and the second direction, the center region being formed at a center portion of at least one of the pair of main surfaces in the second direction.
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8.发明公开公开(公告)号：US20230142607A1
公开(公告)日：2023-05-11
申请号：US17956787
申请日：2022-09-29
发明人： Tadahiko SATO , Ryoichi KATO , Yuma MURATA
CPC分类号： H01L23/49811 , H01G2/06 , H01L21/4853 , H01R4/029 , H01R12/55 , H01R43/0221 , H01L25/072
摘要： A semiconductor module includes an insulating sheet which has a first surface and extends in a first direction and a first terminal. The first terminal has a first region disposed on the first surface of the insulating sheet and having a first width in a second direction perpendicular to the first direction, a second region extending from the first region and having a second width in the second direction narrower than the first width, and a third region located away from the first surface and being electrically connected to both the first region and the second region.
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公开(公告)号：US20190198251A1
公开(公告)日：2019-06-27
申请号：US16331247
申请日：2017-09-28
发明人： Ryuuta Inoue , Yu Miura , Kouichi Nakata
CPC分类号： H01G4/35 , H01G2/02 , H01G2/06 , H01G4/224 , H01G9/00 , H01G9/08 , H01G9/10 , H01G11/78 , H01G11/80 , H01G11/84 , Y02E60/13
摘要： An object of the present invention is to improve the sealability of a capacitor, to maintain the sealability thereof, or to suppress any degradation of the sealability thereof. In a capacitor (2), a base (6) including an insertion through hole (18-1, 18-2) is disposed on a side of an opening sealing member (14) of a capacitor main body (4), the opening sealing member is attached to an open portion of an outer package case (10) of the capacitor main body, and a terminal lead (16-1, 16-2) of the capacitor main body penetrates through the opening sealing member and passes through the insertion through hole to be disposed on an outer side of the base. The capacitor includes a resin layer (8) between the base and the opening sealing member. The base or the opening sealing member includes a protruding portion (20, 317-1) that is adjacent to the resin layer.
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公开(公告)号：US20190172645A1
公开(公告)日：2019-06-06
申请号：US16270745
申请日：2019-02-08
发明人： Jong Pil LEE , Hyo Youn LEE , Sung Kwon AN , Seung Woo SONG , Taek Jung LEE , Jin Kyung JOO
CPC分类号： H01G4/232 , H01G2/06 , H01G4/012 , H01G4/1227 , H01G4/248 , H01G4/30 , H05K1/111 , H05K1/181 , H05K2201/10015 , H05K2201/10636
摘要： A multilayer capacitor and a board having the same provide high capacitance and low equivalent series inductance (ESL). The multilayer capacitor includes a capacitor body including an active region, including first and second internal electrodes, and first and second cover regions. Third and fourth internal electrodes are alternately disposed in the cover region adjacent to a mounting surface. First and second external electrodes respectively contact the first and second internal electrodes to provide capacitance. First and second via electrodes are disposed in the cover region, where the first via electrode connects the third internal electrode and a first band portion of the first external electrode to each other, and where the second via electrode connects the fourth internal electrode and a second band portion of the second external electrode to each other.
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