公开(公告)号：US20230178304A1

公开(公告)日：2023-06-08

申请号：US17975828

申请日：2022-10-28

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： Gyeong Ju Song ,  Beomjoon Cho ,  Younghun Lee ,  Jihong Jo ,  Seungmin Ahn

IPC分类号： H01G4/30 ,  H01G4/224 ,  H01G4/228 ,  H01G4/012 ,  H01G4/12

CPC分类号： H01G4/30 ,  H01G4/012 ,  H01G4/224 ,  H01G4/228 ,  H01G4/1227

摘要： An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, a frame terminal disposed on the external electrode, and a conductive bonding portion disposed between the external electrode and the frame terminal. The frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion.

公开(公告)号：US20230187142A1

公开(公告)日：2023-06-15

申请号：US17979971

申请日：2022-11-03

申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.

发明人： BeomJoon Cho ,  Seungmin Ahn

IPC分类号： H01G4/30 ,  H01G4/248 ,  H01G4/232 ,  H01G4/012 ,  H01G4/12 ,  H01G4/008

CPC分类号： H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/248 ,  H01G4/2325

摘要： An electronic component according to an embodiment including a conductive bonding portion disposed between an external electrode and a frame terminal, and a non-conductive material layer disposed on a band portion of the external electrode. The external electrode may also have a connection portion covering one surface of a body of the electronic component.