公开(公告)号：US20130062112A1

公开(公告)日：2013-03-14

申请号：US13672088

申请日：2012-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Suk Won LEE ,  Keung Jin Sohn ,  Chang Gun Oh

IPC: H01K3/10 ,  H05K1/11

CPC classification number: H05K3/007 ,  H05K3/0097 ,  H05K3/428 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T428/12569 ,  Y10T428/12583 ,  Y10T428/2839

Abstract: A method for fabricating a carrier substrate, a method for fabricating a printed circuit board using the carrier substrate and related printed circuit board. The method for fabricating the carrier substrate includes: providing an insulating base material with a copper foil layer formed on at least one surface thereof; stacking a metal layer having a length shorter than that of the copper foil layer on the copper foil layer; and forming an insulating layer on the metal layer.

Abstract translation: 一种制造载体基板的方法，使用该载体基板和相关印刷电路板制造印刷电路板的方法。 制造载体基板的方法包括：在绝缘基材的至少一个表面上形成铜箔层; 在铜箔层上堆叠长度短于铜箔层的金属层; 以及在所述金属层上形成绝缘层。