公开(公告)号：US08835302B2

公开(公告)日：2014-09-16

申请号：US13866464

申请日：2013-04-19

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/441 ,  H01L23/485

CPC classification number: H01L21/4853 ,  H01L21/441 ,  H01L23/485 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13082

Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.

Abstract translation: 一种制造封装衬底的方法，包括制备具有至少一个导电焊盘的衬底，形成具有开口的绝缘层，以暴露衬底上的导电焊盘，在开口内的导电焊盘上形成分离阻挡层，高于 绝缘层的沿其侧壁的上表面，在分离阻挡层上形成柱端子，并在焊接端子上形成焊料凸点。

公开(公告)号：US20130237049A1

公开(公告)日：2013-09-12

申请号：US13866464

申请日：2013-04-19

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong Gyu Lee ,  Dae Young Lee ,  Tae Joon Chung ,  Seon Jae Mun ,  Jin Won Choi

IPC: H01L21/48

CPC classification number: H01L21/4853 ,  H01L21/441 ,  H01L23/485 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/05572 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13082

Abstract: A method of fabricating a package substrate including preparing a substrate having at least one conductive pad, forming an insulating layer having an opening to expose the conductive pad on the substrate, forming a separation barrier layer on the conductive pad inside the opening to be higher than the upper surface of the insulating layer along the side walls thereof, forming a post terminal on the separation barrier layer, and forming a solder bump on the post terminal.

Abstract translation: 一种制造封装衬底的方法，包括制备具有至少一个导电焊盘的衬底，形成具有开口的绝缘层，以暴露衬底上的导电焊盘，在开口内的导电焊盘上形成分离阻挡层，高于 绝缘层的沿其侧壁的上表面，在分离阻挡层上形成柱端子，并在焊接端子上形成焊料凸点。