公开(公告)号：US20220165493A1

公开(公告)日：2022-05-26

申请号：US17321977

申请日：2021-05-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hoon KIM ,  Chang Hee LEE ,  Jea Hoon LEE ,  Hye Jin KIM ,  Yeo Ju CHO

IPC: H01G2/06 ,  H01G4/30 ,  H01G4/248

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

公开(公告)号：US20180286592A1

公开(公告)日：2018-10-04

申请号：US15876969

申请日：2018-01-22

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Gyoung Heon KO ,  Young Jong YOO ,  Jea Hoon LEE ,  Yeo Ju CHO

IPC: H01G4/30 ,  H01G4/232 ,  H01G4/005 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/005 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A multilayer electronic component has a structure in which an internal electrode connected to a positive (+) terminal of a circuit and an internal electrode connected to a ground of the circuit are implemented together on one dielectric layer and external electrodes commonly use a multi-terminal connected to the ground of the circuit.