公开(公告)号：US20190027826A1

公开(公告)日：2019-01-24

申请号：US15835708

申请日：2017-12-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Sun WON ,  Hee Seung KIM ,  Young Min CHEON ,  Gie Hyoun KWEON ,  Jae Hyuk JANG ,  Ki Won CHANG ,  Chang Hee LEE ,  Hyo Jung YOON ,  Young Seung ROH

IPC: H01Q7/06 ,  H01Q1/38 ,  H04B5/00

CPC classification number: H01Q7/06 ,  H01Q1/38 ,  H04B5/0031 ,  H04B5/0081

Abstract: An antenna module includes a coil part including a second antenna wiring disposed in a spiral shape on an insulating substrate and a first antenna wiring disposed in an internal region of the second antenna wiring; and a magnetic part including a second magnetic part disposed on a second surface of the insulating substrate and a first magnetic part extending from the second magnetic part, penetrating through the internal region of the second antenna wiring, and disposed on a first surface of the insulating substrate.

公开(公告)号：US20180182526A1

公开(公告)日：2018-06-28

申请号：US15793091

申请日：2017-10-25

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Seung KIM ,  Ki Won CHANG ,  Chang Hee LEE ,  Jae Sun WON ,  Hyo Jung YOON ,  Gie Hyoun KWEON

IPC: H01F17/04 ,  H01F38/14 ,  G06K19/06 ,  G06K19/07

Abstract: A coil module including a magnetic body having a first body portion extended in a first axial direction and a second body portion extended in a second axial direction different from the first axial direction; and a transmitting coil including a first coil wound around a portion of the first body portion and a second coil wound around a portion of the second body portion.

公开(公告)号：US20180102811A1

公开(公告)日：2018-04-12

申请号：US15684014

申请日：2017-08-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hee Seung KIM ,  Jae Hyuk JANG ,  Chang Hee LEE ,  Jae Sun WON ,  Hyo Jung YOON ,  Gie Hyoun KWEON

IPC: H04B5/00

CPC classification number: H04B5/0031 ,  G06K7/083 ,  H02M3/18 ,  H02M7/5387 ,  H04B5/0087

Abstract: An information transmitter includes a transmitting coil configured to receive a coil voltage to generate a magnetic field; and a signal generator configured to receive a direct current (DC) voltage and operating switches to apply the coil voltage to the transmitting coil, for a first time constant in a first current path, wherein the coil voltage includes a first value, and for a second time constant in a second current path, wherein the coil voltage includes a second value smaller than the first value, and wherein the first time constant and second time constant are different from each other.

公开(公告)号：US20170278619A1

公开(公告)日：2017-09-28

申请号：US15459366

申请日：2017-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hee LEE ,  Hyo Jung YOON ,  Jae Sun WON ,  Hee Seung KIM

IPC: H01F27/28 ,  H02J7/02 ,  H02J50/10

Abstract: A coil device includes a board, a first pattern formed on one surface of the board, and a second pattern formed on the other surface of the board. At least one pattern via electrically connects the first pattern and the second pattern to each other. A via region, corresponding to a region in which the pattern via is formed in the first pattern, includes n first conducting wires (where n is a natural number of 1 or more). At least a portion of the first pattern, excluding the via region in the first pattern, includes m first conducting wires (where m is greater than n and is a natural number of 2 or more).

公开(公告)号：US20220165493A1

公开(公告)日：2022-05-26

申请号：US17321977

申请日：2021-05-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jae Hoon KIM ,  Chang Hee LEE ,  Jea Hoon LEE ,  Hye Jin KIM ,  Yeo Ju CHO

IPC: H01G2/06 ,  H01G4/30 ,  H01G4/248

Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

公开(公告)号：US20180277954A1

公开(公告)日：2018-09-27

申请号：US15806651

申请日：2017-11-08

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hee LEE ,  Young Seung ROH ,  Jae Sun WON ,  Hee Seung KIM ,  Hyo Jung YOON ,  Gie Hyoun KWEON

IPC: H01Q7/00

CPC classification number: H01Q7/00 ,  H01Q1/38 ,  H01Q7/06 ,  H01Q9/27

Abstract: An antenna module includes a coil part including a second antenna wiring formed on an insulating substrate in a spiral shape and a first antenna wiring disposed in an internal region of the second antenna wiring, and a magnetic part including a first magnetic part disposed in the internal region of a first surface of the insulating substrate and a second magnetic part disposed on a second surface of the insulating substrate.

公开(公告)号：US20170271072A1

公开(公告)日：2017-09-21

申请号：US15298740

申请日：2016-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hee LEE ,  Hee Seung KIM ,  Jae Sun WON

IPC: H01F27/28 ,  H01F38/14 ,  H05K5/04 ,  H05K5/03 ,  H01F27/06 ,  H01F27/32

CPC classification number: H01F27/2804 ,  H01F27/02 ,  H01F27/06 ,  H01F27/2885 ,  H01F27/32 ,  H01F27/36 ,  H01F38/14 ,  H01F2027/065 ,  H02J7/025 ,  H02J50/12 ,  H02J50/70 ,  H05K5/03 ,  H05K5/04

Abstract: A cover and an electronic device are described including the same. The cover includes a center area, a slit, and an inductance part. The center area is disposed on a plate of the cover. The slit is connected to the center area. The inductance part surrounds the center area defined by the slit.

公开(公告)号：US20180138580A1

公开(公告)日：2018-05-17

申请号：US15720815

申请日：2017-09-29

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hee Seung KIM ,  Ki Won CHANG ,  Jae Sun WON ,  Chang Hee LEE ,  Hyo Jung YOON

IPC: H01Q1/24 ,  H01Q1/38 ,  H01Q9/04 ,  H01Q21/00 ,  H01Q9/42

CPC classification number: H01Q1/243 ,  H01F17/0006 ,  H01F2017/0066 ,  H01Q1/38 ,  H01Q7/06 ,  H01Q9/0421 ,  H01Q9/0442 ,  H01Q9/42 ,  H01Q21/0025 ,  H01Q21/28 ,  H04B5/0081

Abstract: An antenna module includes: a coil part including an antenna wiring disposed on an insulating substrate; a first magnetic part disposed on a first surface of the insulating substrate; and a second magnetic part disposed on a second surface of the insulating substrate, wherein the first magnetic part and the second magnetic part overlap with each other on a center region of the antenna wiring.

公开(公告)号：US20180083359A1

公开(公告)日：2018-03-22

申请号：US15644875

申请日：2017-07-10

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyo Jung YOON ,  Hee Seung KIM ,  Jae Sun WON ,  Jae Hyuk JANG ,  Chang Hee LEE ,  Gie Hyoun KWEON ,  Jong Lae KIM

IPC: H01Q7/08 ,  H01Q1/24

CPC classification number: H01Q7/08 ,  H01Q1/243

Abstract: A wireless communication antenna comprises a magnetic body and coil portions. The coil portions have a solenoid shape formed around the magnetic body defining a core. The coil portions are spaced apart from each other and connected to each other in series. Magnetic fields radiated by the coil portions overlap each other and each of the coil portions comprises: a first wiring portion disposed on a first surface of the magnetic body; a second wiring portion disposed on a second surface of the magnetic body; and conductive vias interconnecting the first wiring portion and the second wiring portion.