MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME 有权
    多层陶瓷电子元件及其安装板

    公开(公告)号:US20140318845A1

    公开(公告)日:2014-10-30

    申请号:US13956641

    申请日:2013-08-01

    Abstract: There are provided a multilayer ceramic electronic component and a board for mounting the same. The multilayer ceramic electronic component includes a hexahedral ceramic body including dielectric layers and satisfying T/W>1.0 when a width thereof is defined as W and a thickness thereof is defined as T; an active layer in which capacitance is formed, by including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body, having the dielectric layer interposed therebetween, an upper cover layer formed above the active layer; a lower cover layer formed below the active layer and having a greater thickness than the upper cover layer; and first and second external electrodes covering the end surfaces of the ceramic body, wherein when a thickness of the lower cover layer is defined as Tb, 0.03≦Tb/T≦0.25 is satisfied.

    Abstract translation: 提供了一种多层陶瓷电子部件和用于安装它的基板。 多层陶瓷电子部件包括:当宽度被定义为W且其厚度定义为T时,包括电介质层并满足T / W> 1.0的六面体陶瓷体; 形成电容的有源层,通过包括交替暴露于陶瓷体的两端面的多个第一和第二内部电极,其间具有电介质层,形成在有源层上方的上覆盖层; 在所述有源层下面形成并且具有比所述上覆盖层更大的厚度的下覆盖层; 以及覆盖陶瓷体的端面的第一外部电极和第二外部电极,其中当将下覆盖层的厚度定义为Tb时,满足0.03≦̸ Tb / T≦̸ 0.25。

    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME 有权
    电阻元件及其制造方法

    公开(公告)号:US20160172084A1

    公开(公告)日:2016-06-16

    申请号:US14953940

    申请日:2015-11-30

    CPC classification number: H01C1/142 H01C1/01 H01C1/012 H01C17/006 H01C17/281

    Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

    Abstract translation: 电阻元件包括基底基板,设置在基底基板的一个表面上的电阻层,设置在彼此间隔开的电阻层上的第一电极层和第二电极层,设置在第一电极层 并且所述第二电极层与所述第一电极层和所述第二电极层间隔开并且比所述第一电极层和所述第二电极层中的每一个均厚,以及设置在所述第一至第三电极层上的第一至第三镀层, 分别。

    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    RESISTOR ELEMENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电阻元件及其制造方法

    公开(公告)号:US20160172083A1

    公开(公告)日:2016-06-16

    申请号:US14938716

    申请日:2015-11-11

    CPC classification number: H01C1/142 H01C1/012 H01C7/003 H01C17/06 H01C17/283

    Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

    Abstract translation: 电阻元件包括基底基板,设置在基底基板的一个表面上的电阻层,设置在电阻层上彼此间隔开的第一电极层和第二电极层,设置在第一电极层之间的第三电极层 电极层和与第一电极层和第二电极层间隔开的第二电极层,设置在第三电极层的至少一端的导电树脂电极和设置在第一至第三电极层上的第一至第三电镀层 电极层。

    ELECTRONIC COMPONENT AND BOARD FOR MOUNTING THE SAME

    公开(公告)号:US20220165493A1

    公开(公告)日:2022-05-26

    申请号:US17321977

    申请日:2021-05-17

    Abstract: An electronic component includes: a multilayer capacitor including a capacitor body and a pair of external electrodes, respectively disposed on external surfaces of the capacitor body in a first direction; and an interposer disposed below the multilayer capacitor and including an interposer body, a pair of via holes penetrating through the interposer body, and a pair of via electrodes, respectively disposed in the via holes to be connected to the pair of external electrodes, respectively. 0.24T≤t≤0.3T, where “T” is a maximum height of the multilayer capacitor and “t” is a maximum height of the interposer.

    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    7.
    发明申请
    COMPOSITE ELECTRONIC COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    复合电子元件及其安装板

    公开(公告)号:US20150116966A1

    公开(公告)日:2015-04-30

    申请号:US14188424

    申请日:2014-02-24

    Abstract: There is provided a composite electronic component including a composite body having a capacitor and an inductor coupled to each other, the capacitor including a ceramic body in which a plurality of dielectric layers and first and second internal electrodes facing each other with the dielectric layers interposed therebetween are stacked, and the inductor including a magnetic body including a coil part; a first input terminal; an output terminal; and a ground terminal.

    Abstract translation: 提供了一种复合电子部件,其包括具有彼此耦合的电容器和电感器的复合体,所述电容器包括陶瓷体,多个电介质层和第一和第二内部电极彼此面对并且介电层插入其间 并且所述电感器包括包括线圈部分的磁体; 第一输入端; 输出端子; 和地面终端。

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