Multilayer electronic component
    2.
    发明授权

    公开(公告)号:US12198862B2

    公开(公告)日:2025-01-14

    申请号:US17957017

    申请日:2022-09-30

    Abstract: A multilayer electronic component includes a plurality of capacitance forming portions including a first dielectric layer and an internal electrode disposed in a first direction, and an intermediate layer disposed between capacitance forming portions adjacent to each other and including a second dielectric layer, a body including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body and connected to the internal electrode. The second dielectric layer includes graphene. The first dielectric layer does not include graphene, or includes graphene in a content less than a content of graphene included in the second dielectric layer.

    Electronic component
    3.
    发明授权

    公开(公告)号:US11328870B2

    公开(公告)日:2022-05-10

    申请号:US16852808

    申请日:2020-04-20

    Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.

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