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公开(公告)号:US11610740B2
公开(公告)日:2023-03-21
申请号:US17370297
申请日:2021-07-08
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Yeong Lim Kwon , Jung Min Park , Se Hun Park , Young Ghyu Ahn , Soo Hwan Son , Seung Yong Lee , Yu Ra Shin
Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and first and second internal electrodes with the dielectric layer interposed therebetween, the dielectric layer and the first and second internal electrodes arranged to be stacked, and a first cover portion disposed on the capacitance portion, and a second cover portion disposed on the capacitance portion, a first external electrode connected to the first internal electrode, and a second external electrode connected to the second internal electrode. The first cover portion and the second cover portion include a cover reinforcing layer including graphene.
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公开(公告)号:US12198862B2
公开(公告)日:2025-01-14
申请号:US17957017
申请日:2022-09-30
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Yeong Lim Kwon , Soo Hwan Son , Jung Min Park , Se Hun Park
Abstract: A multilayer electronic component includes a plurality of capacitance forming portions including a first dielectric layer and an internal electrode disposed in a first direction, and an intermediate layer disposed between capacitance forming portions adjacent to each other and including a second dielectric layer, a body including first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body and connected to the internal electrode. The second dielectric layer includes graphene. The first dielectric layer does not include graphene, or includes graphene in a content less than a content of graphene included in the second dielectric layer.
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公开(公告)号:US11328870B2
公开(公告)日:2022-05-10
申请号:US16852808
申请日:2020-04-20
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor: Ho Yoon Kim , Yeong Lim Kwon
Abstract: An electronic component includes a multilayer capacitor including a capacitor body having first to sixth surfaces, and first and second external electrodes; and an interposer including an interposer body and first and second external terminals; and the capacitor body includes a plurality of dielectric layers and a plurality of first and second internal electrodes, the first and second internal electrodes are exposed through the third and fourth surfaces of the capacitor body, respectively, and the interposer further includes first and second solder fillet limiting layers disposed on upper sides of both surfaces of each of the first and second external terminals in the first direction, respectively.
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