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    MULTILAYER BEAD AND BOARD HAVING THE SAME
    2.
    发明申请
    MULTILAYER BEAD AND BOARD HAVING THE SAME 审中-公开

    公开(公告)号：US20190013121A1

    公开(公告)日：2019-01-10

    申请号：US15824947

    申请日：2017-11-28

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Jin HA ,  Jeong Hwan IM ,  So Young JUN ,  Sung Jin PARK

    IPC: H01C13/02 ,  H01F17/00 ,  H01C7/02 ,  H05K1/18 ,  H01F27/29

    Abstract: A multilayer bead includes a body in which a plurality of ceramic layers are stacked; a plurality of internal electrode patterns formed on the plurality of ceramic layers; and first and second external electrodes formed on both end surfaces of the body and electrically connected to both ends of an internal coil formed by a combination of the plurality of internal electrode patterns, respectively. A stacking direction of the plurality of ceramic layers is parallel to both end surfaces of the body on which the first and second external electrodes are formed, and a coil axis of the internal coil is parallel to a mounting surface of the body. A board having the multilayer bead may be provided.

    MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    4.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    多层电子元件和板

    公开(公告)号：US20150371755A1

    公开(公告)日：2015-12-24

    申请号：US14504107

    申请日：2014-10-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jeong Hwan IM ,  So Young JUN ,  Hyun Ju JUNG ,  Sung Jin PARK ,  Young Jin HA

    IPC: H01F27/28

    CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F2017/002 ,  H01F2027/2809

    Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.

    Abstract translation: 多层电子部件可以包括：多层体，包括多个绝缘层; 通过将布置在所述多个绝缘层上的各个导电图案彼此电连接而提供的内部线圈部分; 以及设置在多层体的两端面上的第一外部电极和第二外部电极。 设置在多层体的周边区域中的至少一个导电图案的周边可以小于布置在多层体的中心区域中的导电图案的周边。

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