公开(公告)号：US20150163924A1

公开(公告)日：2015-06-11

申请号：US14243431

申请日：2014-04-02

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin CHO ,  Hyo Jin YOON ,  Suk Jin HAM

IPC: H05K3/30 ,  H05K1/18

CPC classification number: H05K3/305 ,  H05K1/0269 ,  H05K2203/161 ,  H05K2203/166 ,  Y02P70/613

Abstract: Embodiments of the invention provide a method and device for bonding an electronic component with improved adhesive force. In accordance with at least one embodiment, the method includes preparing a printed circuit board, coating an optical alignment polymer on a bonding region of the printed circuit board, for bonding the electronic component, aligning the optical alignment polymer by irradiating the printed circuit board with UV, coating an adhesive agent on the optical alignment polymer, and mounting the electronic component on the adhesive agent.

Abstract translation: 本发明的实施例提供一种用于以改进的粘合力粘合电子部件的方法和装置。 根据至少一个实施方案，该方法包括制备印刷电路板，在印刷电路板的接合区域上涂布光学取向聚合物，用于粘结电子部件，通过将印刷电路板与 UV，在光学取向聚合物上涂覆粘合剂，并将电子部件安装在粘合剂上。

公开(公告)号：US20140178814A1

公开(公告)日：2014-06-26

申请号：US13794099

申请日：2013-03-11

Applicant: SAMSUNG ELECTRO-MECHANICS CO. LTD.

Inventor： Hyo Jin YOON ,  Hye Jin CHO ,  Ji Eun JEON ,  Sung Hee LIM ,  Suk Jin HAM

IPC: G03F7/09

CPC classification number: G03F7/092 ,  G03F7/11

Abstract: There is provided a dry film photoresist including: a base film having an oxygen permeable barrier layer formed thereon; a photosensitive resin layer formed on the oxygen permeable barrier layer; and a protective film formed on the photosensitive resin layer. According to the present invention, the dry film photoresist includes the oxygen permeable barrier layer formed on the base film to prevent a curing reaction from being deteriorated by oxygen permeation in the dry film photoresist, such that residue that is not peeled off may be decreased, thereby significantly decreasing process defects.

Abstract translation: 提供了一种干膜光致抗蚀剂，包括：其上形成有氧可渗透阻挡层的基膜; 形成在透氧阻挡层上的感光性树脂层; 以及形成在感光性树脂层上的保护膜。 根据本发明，干膜光致抗蚀剂包括形成在基膜上的透氧阻挡层，以防止干膜光致抗蚀剂中的氧渗透导致固化反应劣化，使得未剥离的残留物可能降低， 从而显着降低工艺缺陷。

公开(公告)号：US20140041206A1

公开(公告)日：2014-02-13

申请号：US13843640

申请日：2013-03-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hye Jin CHO ,  Hyo Jin YOON ,  Suk Jin HAM ,  Sung Hee LIM ,  Seong Chan PARK ,  Ji Eun JEON

IPC: H05K3/00

CPC classification number: H05K3/0094 ,  H05K3/225 ,  H05K3/4069 ,  H05K3/42 ,  H05K2203/121 ,  Y10T29/49004 ,  Y10T29/49124

Abstract: Disclosed herein is a method for repairing a via in which a dimple phenomenon occurs, in the case in which a dimple error occurs at the time of a process of forming the via used for electrically connecting between layers of a multi-layers circuit board. The method for repairing a via according to an exemplary embodiment of the present invention includes judging whether or not a dimple error occurs in a via; and repairing the via in which the dimple error occurs.

Abstract translation: 这里公开了在形成用于多层电路板的层之间的电连接的通孔的形成处理时发生凹坑错误的情况下，修复其中发生凹坑现象的通孔的方法。 根据本发明的示例性实施例的修复通孔的方法包括判断通孔中是否出现凹坑错误; 并修复出现凹坑错误的通孔。