公开(公告)号：US20140370301A1

公开(公告)日：2014-12-18

申请号：US14374465

申请日：2012-12-19

申请人： KANEKA CORPORATION

发明人： Yoshihide Sekito

IPC分类号： C08L75/04 ,  H05K3/28

CPC分类号： C08L75/04 ,  C08G18/0823 ,  C08G18/44 ,  C08G18/4854 ,  C08G18/6659 ,  C08G18/758 ,  C08G18/792 ,  C08J5/18 ,  C08J2375/04 ,  C08L2205/025 ,  C08L2205/03 ,  H05K3/285 ,  H05K2203/161 ,  Y10T428/31551 ,  C08L33/12

摘要： According to a resin composition for a pigment-containing insulating film which resin composition contains at least a (A) binder polymer and (B) pigment-containing cross-linked polymer particles, it is possible to provide a resin composition for a pigment-containing insulating film which resin composition is excellent in tack property after drying and allows a resultant pigment-containing insulating film to be excellent in flexibility and electrical insulation reliability and to be small in warpage after curing, a resin film for a pigment-containing insulating film, a pigment-containing insulating film, and a printed wiring board provided with a pigment-containing insulating film.

摘要翻译： 根据用于含颜料的绝缘膜的树脂组合物，该树脂组合物至少含有（A）粘合剂聚合物和（B）含颜料的交联聚合物颗粒，可以提供含颜料的绝缘膜用树脂组合物 绝缘膜，该树脂组合物在干燥后的粘着性优异，并且使得到的含颜料的绝缘膜具有优异的柔软性和电绝缘可靠性，并且固化后的翘曲小，用于含颜料的绝缘膜的树脂膜， 含颜料的绝缘膜和设置有含颜料的绝缘膜的印刷线路板。

公开(公告)号：US08907225B1

公开(公告)日：2014-12-09

申请号：US14221833

申请日：2014-03-21

申请人： The United States of America as represented by the Secretary of the Navy

发明人： Nishkamraj U Deshpande ,  H. Fred Barsun ,  Ron Shoultz

IPC分类号： H05K1/02 ,  H05K3/28 ,  H01L23/31 ,  H05K3/30

CPC分类号： H05K1/0275 ,  H05K3/28 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0769 ,  H05K2201/09872 ,  H05K2203/161 ,  Y10T29/49146 ,  Y10T428/1405

摘要： A method and an apparatus for mitigating electrical failures caused by intrusive structures. Such structures can be tin whiskers forming on electrical circuits. In an illustrative embodiment, nano-capsules are filled with some type of insulative and adhesive fluid that is adapted to bind to and coat an intrusive structure, e.g., a whisker, making the whisker electrically inactive and thereby reducing the electrical faults that can be caused by the whisker. In another illustrative embodiment, randomly oriented nano-fibers having an elastic modulus higher than tin or any other whisker material is used to arrest a growth or movement of a whisker and further reduce a likelihood that a whisker can cause an electrical fault.

摘要翻译： 一种用于减轻由侵入式结构引起的电气故障的方法和装置。 这种结构可以是在电路上形成的锡晶须。 在说明性实施例中，纳米胶囊填充有某种类型的绝缘和粘合剂流体，其适于结合并涂覆侵入结构（例如晶须），使晶须电不活动，从而减少可能引起的电气故障 由晶须 在另一个说明性实施例中，使用弹性模量高于锡或任何其它晶须材料的随机取向的纳米纤维来阻止晶须的生长或移动，并进一步降低晶须可能导致电气故障的可能性。

公开(公告)号：US20130016465A1

公开(公告)日：2013-01-17

申请号：US13182906

申请日：2011-07-14

申请人： Bruce John Chamberlin ,  Chang-Min Chu ,  Gao-Bin Hu ,  Joseph Kuczynski ,  Kaspar Ka Chung Tsang

发明人： Bruce John Chamberlin ,  Chang-Min Chu ,  Gao-Bin Hu ,  Joseph Kuczynski ,  Kaspar Ka Chung Tsang

IPC分类号： G06F1/16 ,  G01R31/28 ,  H05K1/00

CPC分类号： G01N21/80 ,  H05K1/0269 ,  H05K3/22 ,  H05K3/225 ,  H05K3/42 ,  H05K2203/16 ,  H05K2203/161 ,  Y10T29/49004

摘要： An approach is provided in which a pH-indicating compound is incorporated in a printed circuit board. The printed circuit board includes a number of layers with the pH-sensitive indicator being incorporated in one of the layers. Conductive pathways are formed from a conductive sheet laminated onto an outer surface of the printed circuit board. The printed circuit board is exposed to a pH-activating solution. Plated-through hole defects in the printed circuit board are identified by detecting a color formation at a surface location of the printed circuit board that corresponds to the plated-through hole defect. Another approach is also provided where a pH-activating compound is incorporated in one of the layers of the printed circuit board which is then exposed to a pH-indicating solution to produce the color formation that identifies the location of the plated-through hole defect.

摘要翻译： 提供了其中将pH指示化合物并入印刷电路板中的方法。 印刷电路板包括多个层，其中pH敏感指示器被结合在一个层中。 导电路径由层叠在印刷电路板的外表面上的导电片形成。 将印刷电路板暴露于pH活化溶液。 通过检测印刷电路板的与镀通孔缺陷相对应的表面位置处的颜色形成来识别印刷电路板中的通孔缺陷。 还提供另一种方法，其中将pH活化化合物并入印刷电路板的一个层中，然后暴露于pH指示溶液以产生识别电镀通孔缺陷位置的着色层。

公开(公告)号：US20120292083A1

公开(公告)日：2012-11-22

申请号：US13562500

申请日：2012-07-31

申请人： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

发明人： Shingo YOSHIOKA ,  Hiroaki FUJIWARA

IPC分类号： H05K3/46 ,  H05K1/02 ,  H05K3/10

CPC分类号： H05K3/184 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2924/15173 ,  H01L2924/15311 ,  H05K1/0206 ,  H05K1/023 ,  H05K1/0269 ,  H05K1/0284 ,  H05K1/11 ,  H05K1/162 ,  H05K3/0014 ,  H05K3/0032 ,  H05K3/107 ,  H05K3/381 ,  H05K3/4069 ,  H05K3/4647 ,  H05K3/4661 ,  H05K2201/09381 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/2072 ,  H05K2203/0108 ,  H05K2203/0565 ,  H05K2203/161 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention relates to a method of producing a circuit board, comprising: a film-forming step of forming a resin film on the surface of an insulative substrate; a circuit groove-forming step of forming circuit grooves having a depth equal to or greater than the thickness of the resin film on the external surface of the resin film; a catalyst-depositing step of depositing a plating catalyst or the precursor thereof on the surface of the circuit grooves on the insulative substrate and the surface of the resin film; a film-removing step of removing the resin film; and a plating processing step of electroless-plating the insulative substrate after removal of the resin film, wherein a partial reinforcing structure is formed in a region of the circuit groove in the circuit groove-forming step.

摘要翻译： 本发明涉及电路板的制造方法，其特征在于，包括：在绝缘性基板的表面上形成树脂膜的成膜工序; 电路槽形成步骤，形成深度等于或大于树脂膜的外表面上的树脂膜的厚度的电路槽; 催化剂沉积步骤，在绝缘基板和树脂膜的表面上的电路槽的表面上沉积电镀催化剂或其前体; 除去树脂膜的除膜工序; 以及电镀处理步骤，在去除所述树脂膜之后对所述绝缘基板进行无电镀，其中在所述电路槽形成步骤中在所述电路槽的区域中形成部分增强结构。

公开(公告)号：US20120268658A1

公开(公告)日：2012-10-25

申请号：US13346561

申请日：2012-01-09

申请人： Kenji HASEGAWA

发明人： Kenji HASEGAWA

IPC分类号： H04N5/50 ,  H05K7/00 ,  H04N5/64

CPC分类号： H04N5/64 ,  H05K1/0266 ,  H05K1/0269 ,  H05K3/28 ,  H05K2203/161

摘要： According to one embodiment, an electronic apparatus includes a housing and a module. The housing includes an opening portion. The module includes a first region colored in a first color and a second region exposed from the opening portion and colored in a second color which is different from the first color.

摘要翻译： 根据一个实施例，电子设备包括壳体和模块。 壳体包括开口部分。 模块包括以第一颜色着色的第一区域和从开口部分露出的第二区域，并以不同于第一颜色的第二颜色着色。

公开(公告)号：US20120162937A1

公开(公告)日：2012-06-28

申请号：US13207152

申请日：2011-08-10

申请人： MIN-AN CHING

发明人： MIN-AN CHING

IPC分类号： H05K1/00 ,  H05K5/00

CPC分类号： H01R12/79 ,  H01R12/88 ,  H05K1/0269 ,  H05K2203/161

摘要： A circuit board assembly includes a circuit board, a fixing device, and a color-changing layer. The fixing device is capable of holding and securing the circuit board and includes a main body and a cover. The cover is rotatably hinged to the main body. The color-changing layer is located on either or both of the circuit board and cover. When the circuit board is assembled at a predetermined position of the fixing device and is secured on the main body by the cover, the cover exerts a pressure to form protruding points on the color-changing layer at the positions corresponding to the elastic contacts, the color-changing generates an electric field and changes color, which is easily and quickly verifiable by a worker.

摘要翻译： 电路板组件包括电路板，固定装置和变色层。 固定装置能够保持和固定电路板，并且包括主体和盖。 盖可旋转地铰接到主体。 变色层位于电路板和盖板的一个或两个上。 当电路板组装在定影装置的预定位置并且通过盖固定在主体上时，盖在与弹性触点对应的位置处施加压力以在变色层上形成突出点， 颜色变化产生电场并改变颜色，这是工作人员容易且快速地验证的。

公开(公告)号：US20110290536A1

公开(公告)日：2011-12-01

申请号：US13093915

申请日：2011-04-26

申请人： Kentaro Kaneko ,  Hitoshi Kondo ,  Kotaro Kodani ,  Tomoyuki Shimodaira

发明人： Kentaro Kaneko ,  Hitoshi Kondo ,  Kotaro Kodani ,  Tomoyuki Shimodaira

IPC分类号： H05K1/02 ,  H05K1/00

CPC分类号： H05K1/0269 ,  H05K3/285 ,  H05K2203/161

摘要： A wiring substrate includes a wiring layer, and an insulating layer configured to cover the wiring layer, wherein the insulating layer is recognized to have any color in a range from purple to blue.

摘要翻译： 布线基板包括布线层和覆盖布线层的绝缘层，其中绝缘层被识别为具有从紫色到蓝色的范围内的任何颜色。

公开(公告)号：US08034531B2

公开(公告)日：2011-10-11

申请号：US10535373

申请日：2003-11-19

申请人： Hidetaka Oka ,  Jean-Marie Adam

发明人： Hidetaka Oka ,  Jean-Marie Adam

IPC分类号： G03C1/00 ,  C09B47/04 ,  C09B62/00 ,  C09B67/00

CPC分类号： H05K3/287 ,  G03F7/038 ,  G03F7/105 ,  H05K1/0269 ,  H05K3/0076 ,  H05K2203/161

摘要： The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C1,-C4.-Alkyl, R2 is hydrogen or C1,-C4-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C1,-C6alkyl, C1,-C6alkoxy, hydroxy, NHCOR3, NHSO2, R4 or SO2NHR5, wherein R3, is C1,-C4,-Alkyl or phenyl, R4, is C1,-C4-Alkyl or phenyl and R5 is C1,-C4-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.

摘要翻译： 本发明涉及一种光敏树脂组合物，其包含a）作为组分（A）的式（I）的绿色着色剂，其中环A，B，C和D被羟基或部分取代，其中R 1是氢 或C 1 -C 4 - 烷基，R 2是氢或C 1 -C 4烷基，n是0,1,2或3，并且环E是未取代的或被C 1 -C 6烷基，C 1 -C 6烷氧基，羟基， NHCOR3，NHSO2，R4或SO2NHR5，其中R3是C1，-C4， - 烷基或苯基，R4是C1，-C4-烷基或苯基，R5是C1，-C4-烷基或苯基，b） （B）碱溶性低聚物或聚合物（反应性或非反应性），c）作为组分（C）可聚合单体，d）作为组分（D）的光引发剂，e）作为组分（E）的环氧化合物， 并且如果需要，f）作为组分（F）在印刷电路板的制造中用作阻焊剂的另外的添加剂，抗蚀剂或电镀抗蚀剂。

公开(公告)号：US07742312B2

公开(公告)日：2010-06-22

申请号：US11773279

申请日：2007-07-03

申请人： Te-Wei Li

发明人： Te-Wei Li

IPC分类号： H05K7/00

CPC分类号： H05K1/144 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/40 ,  H04M1/0277 ,  H05K1/16 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/0999 ,  H05K2201/10303 ,  H05K2203/161 ,  Y10T428/31504 ,  Y10T428/31551

摘要： An electronic device and method of fabrication are provided. The electronic device comprises a substrate, a patterned conductive layer serving as an antenna layer formed on the outer surface of the substrate, electrically connected with a printed circuit board (PCB) for sending or receiving a wireless signal, wherein the substrate is placed between the patterned conductive layer and PCB. The patterned conductive layer may be electrically connected to the PCB through a hole in the substrate by a connecting piece. The substrate may be a housing of the electronic device.

摘要翻译： 提供了一种电子设备和制造方法。 该电子设备包括：衬底，用作形成在衬底的外表面上的天线层的图案化导电层，与用于发送或接收无线信号的印刷电路板（PCB）电连接，其中衬底放置在 图案导电层和PCB。 图案化导电层可以通过连接片通过基板中的孔与PCB电连接。 基板可以是电子设备的壳体。

公开(公告)号：US07691458B2

公开(公告)日：2010-04-06

申请号：US10816132

申请日：2004-03-31

申请人： Gary A. Brist ,  Patrick D. Boyd

发明人： Gary A. Brist ,  Patrick D. Boyd

IPC分类号： C09K19/00

CPC分类号： H05K1/0269 ,  G01D7/005 ,  H05K3/3452 ,  H05K2203/1105 ,  H05K2203/161 ,  Y10S428/901 ,  Y10S428/913 ,  Y10S428/92 ,  Y10T428/1036 ,  Y10T428/24917

摘要： Numerous embodiments of a carrier substrate having thermochromatic materials are described. In one embodiment of the present invention, a carrier substrate has a visible surface, and a thermochromatic material is disposed near the carrier substrate. The thermochromatic material produces a visual change of the visible surface when an activation temperature of the thermochromatic material is reached.

摘要翻译： 描述了具有热色材料的载体衬底的许多实施例。 在本发明的一个实施例中，载体衬底具有可见表面，并且热色材料设置在载体衬底附近。 当达到热色材料的活化温度时，热色材料产生可视表面的视觉变化。