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公开(公告)号:US09627279B2
公开(公告)日:2017-04-18
申请号:US14502463
申请日:2014-09-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Won Soo Ji , Choo Ho Kim , Sung Hoon Oh , Min Hwan Kim , Beom Seok Shin
CPC classification number: H01L22/14 , G01R31/2601 , G01R31/2635 , H01L33/48 , H01L2933/0033 , H01L2933/005 , Y10T29/51
Abstract: An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.
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公开(公告)号:US11442107B2
公开(公告)日:2022-09-13
申请号:US17206288
申请日:2021-03-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Beom Seok Shin , Jinsoo Park
IPC: G01R31/3185 , G01R31/3177 , G01R31/317
Abstract: A system-on-chip includes a first scan register being in a first core and being closest to an input port of the first core; an inverting circuit on a feedback path of the first scan register; a second scan register in the first core; and a logic circuit on a data path between the first scan register and the second scan register. In a test mode for an AT-SPEED test of the logic circuit, the inverting circuit generates test data by inverting scan data that are output from the first scan register, the first scan register stores the test data in response to a first pulse of a clock signal, the logic circuit generates result data based on the test data that are output from the first scan register, and the second scan register stores the result data in response to a second pulse of the clock signal.
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公开(公告)号:US10969432B2
公开(公告)日:2021-04-06
申请号:US16544160
申请日:2019-08-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Beom Seok Shin , Jinsoo Park
IPC: G01R31/3185 , G01R31/3177 , G01R31/317
Abstract: A system-on-chip includes a first scan register being in a first core and being closest to an input port of the first core; an inverting circuit on a feedback path of the first scan register; a second scan register in the first core; and a logic circuit on a data path between the first scan register and the second scan register. In a test mode for an AT-SPEED test of the logic circuit, the inverting circuit generates test data by inverting scan data that are output from the first scan register, the first scan register stores the test data in response to a first pulse of a clock signal, the logic circuit generates result data based on the test data that are output from the first scan register, and the second scan register stores the result data in response to a second pulse of the clock signal.
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