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公开(公告)号:US20200220006A1
公开(公告)日:2020-07-09
申请号:US16816971
申请日:2020-03-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: JUNG-GIL YANG , Beom-Jin Park , Seung-Min Song , Geum-Jong Bae , Dong-Il Bae
IPC: H01L29/78 , H01L29/775 , H01L29/423 , H01L29/786 , H01L29/66 , H01L21/8234 , H01L21/762 , H01L21/308 , H01L29/06
Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are disposed at a plurality of levels, respectively, and spaced apart from each other in a vertical direction on an upper surface of a substrate. The gate structure is disposed on the substrate, at least partially surrounds a surface of each of the channels, and extends in a first direction substantially parallel to the upper surface of the substrate. The source/drain layer is disposed at each of opposite sides of the gate structure in a second direction substantially parallel to the upper surface of the substrate and substantially perpendicular to the first direction and is connected to sidewalls of the channels. A length of the gate structure in the second direction changes along the first direction at a first height from the upper surface of the substrate in the vertical direction.
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公开(公告)号:US11923456B2
公开(公告)日:2024-03-05
申请号:US17659571
申请日:2022-04-18
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung-Gil Yang , Beom-Jin Park , Seung-Min Song , Geum-Jong Bae , Dong-Il Bae
IPC: H01L29/78 , H01L21/308 , H01L21/762 , H01L21/8234 , H01L29/06 , H01L29/423 , H01L29/66 , H01L29/775 , H01L29/786
CPC classification number: H01L29/785 , H01L21/3086 , H01L21/762 , H01L21/823431 , H01L29/0649 , H01L29/42392 , H01L29/66545 , H01L29/6656 , H01L29/6681 , H01L29/775 , H01L29/78696
Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are disposed at a plurality of levels, respectively, and spaced apart from each other in a vertical direction on an upper surface of a substrate. The gate structure is disposed on the substrate, at least partially surrounds a surface of each of the channels, and extends in a first direction substantially parallel to the upper surface of the substrate. The source/drain layer is disposed at each of opposite sides of the gate structure in a second direction substantially parallel to the upper surface of the substrate and substantially perpendicular to the first direction and is connected to sidewalls of the channels. A length of the gate structure in the second direction changes along the first direction at a first height from the upper surface of the substrate in the vertical direction.
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公开(公告)号:US11309421B2
公开(公告)日:2022-04-19
申请号:US16816971
申请日:2020-03-12
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung-Gil Yang , Beom-Jin Park , Seung-Min Song , Geum-Jong Bae , Dong-Il Bae
IPC: H01L29/78 , H01L29/06 , H01L29/66 , H01L21/308 , H01L21/762 , H01L21/8234 , H01L29/786 , H01L29/423 , H01L29/775
Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are disposed at a plurality of levels, respectively, and spaced apart from each other in a vertical direction on an upper surface of a substrate. The gate structure is disposed on the substrate, at least partially surrounds a surface of each of the channels, and extends in a first direction substantially parallel to the upper surface of the substrate. The source/drain layer is disposed at each of opposite sides of the gate structure in a second direction substantially parallel to the upper surface of the substrate and substantially perpendicular to the first direction and is connected to sidewalls of the channels. A length of the gate structure in the second direction changes along the first direction at a first height from the upper surface of the substrate in the vertical direction.
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公开(公告)号:US20190157444A1
公开(公告)日:2019-05-23
申请号:US16115114
申请日:2018-08-28
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jung-Gil Yang , Beom-Jin Park , Seung-Min Song , Geum-Jong Bae , Dong-Il Bae
IPC: H01L29/78 , H01L29/06 , H01L29/66 , H01L21/762 , H01L21/8234 , H01L21/308
Abstract: A semiconductor device includes channels, a gate structure, and a source/drain layer. The channels are disposed at a plurality of levels, respectively, and spaced apart from each other in a vertical direction on an upper surface of a substrate. The gate structure is disposed on the substrate, at least partially surrounds a surface of each of the channels, and extends in a first direction substantially parallel to the upper surface of the substrate. The source/drain layer is disposed at each of opposite sides of the gate structure in a second direction substantially parallel to the upper surface of the substrate and substantially perpendicular to the first direction and is connected to sidewalls of the channels. A length of the gate structure in the second direction changes along the first direction at a first height from the upper surface of the substrate in the vertical direction.
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