公开(公告)号：US20160079478A1

公开(公告)日：2016-03-17

申请号：US14696239

申请日：2015-04-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Bo Hyun KONG ,  Young Min PARK ,  Dong Hyun CHO

IPC: H01L33/38 ,  H01L33/32 ,  H01L33/58 ,  H01L33/40 ,  H01L33/06 ,  H01L33/42

CPC classification number: H01L33/385 ,  H01L33/405 ,  H01L33/42 ,  H01L33/62

Abstract: A semiconductor light emitting device package may include: a package body having first and second electrode structures; and a light emitting diode chip mounted on the second electrode structure of the package body, the light emitting diode chip including: a support substrate, a light emitting structure including a second conductivity type semiconductor layer, an active layer and a first conductivity type semiconductor layer sequentially stacked on the support substrate, a transparent electrode layer disposed on the first conductivity type semiconductor layer, and an insulating layer disposed on at least a side surface of the light emitting structure. The transparent electrode layer and the first electrode structure may be connected to each other by a side electrode disposed on a side surface of the light emitting diode chip.

Abstract translation: 半导体发光器件封装可以包括：具有第一和第二电极结构的封装体; 以及安装在所述封装体的第二电极结构上的发光二极管芯片，所述发光二极管芯片包括：支撑基板，包括第二导电类型半导体层，有源层和第一导电类型半导体层的发光结构 依次堆叠在支撑基板上，设置在第一导电类型半导体层上的透明电极层和设置在发光结构的至少侧面上的绝缘层。 透明电极层和第一电极结构可以通过设置在发光二极管芯片的侧表面上的侧电极彼此连接。