公开(公告)号：US20150366050A1

公开(公告)日：2015-12-17

申请号：US14682624

申请日：2015-04-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Bo-in Noh ,  Sang-won KIM

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03

CPC分类号： H05K1/147 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/32 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/32145 ,  H01L2224/73211 ,  H01L2224/73269 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/15311 ,  H05K1/144 ,  H05K2201/043

摘要： A semiconductor package includes: a first substrate; a second substrate disposed on the first substrate to be spaced apart from the first substrate, and including an active region on which semiconductor devices are configured to be mounted; and a flexible interconnection member electrically connecting the first substrate to the second substrate, the flexible interconnection member including a flexible film and a metal wiring member formed on the flexible film.

摘要翻译： 半导体封装包括：第一基板; 第二基板，设置在与第一基板间隔开的第一基板上，并且包括有源区域，半导体器件被配置为在其上安装; 以及将第一基板电连接到第二基板的柔性互连部件，柔性互连部件包括柔性膜和形成在柔性膜上的金属布线部件。

公开(公告)号：US10354967B2

公开(公告)日：2019-07-16

申请号：US15456882

申请日：2017-03-13

申请人： Samsung Electronics Co., Ltd.

发明人： Jung-woo Kim ,  Woon-bae Kim ,  Bo-in Noh ,  Go-woon Seong ,  Ji-yong Park

IPC分类号： H01L23/48 ,  H01L21/44 ,  H01L23/00

摘要： A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.