公开(公告)号：US20170162538A1

公开(公告)日：2017-06-08

申请号：US15441741

申请日：2017-02-24

申请人： EV GROUP E. THALLNER GMBH

发明人： Markus WIMPLINGER

IPC分类号： H01L23/00 ,  B81C3/00

CPC分类号： H01L24/83 ,  B81C3/001 ,  B81C2203/036 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/29105 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29117 ,  H01L2224/29118 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29184 ,  H01L2224/32145 ,  H01L2224/32507 ,  H01L2224/8302 ,  H01L2224/83022 ,  H01L2224/8381 ,  H01L2224/83894 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01034 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01322 ,  H01L2924/10251 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/1026 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10323 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/10336 ,  H01L2924/10346 ,  H01L2924/1037 ,  H01L2924/10371 ,  H01L2924/10372 ,  H01L2924/10373 ,  H01L2924/10375 ,  H01L2924/10376 ,  H01L2924/10377 ,  H01L2924/10821 ,  H01L2924/10823 ,  H01L2924/10831 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01013 ,  H01L2924/01031 ,  H01L2924/0103

摘要： A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.

公开(公告)号：US20150366050A1

公开(公告)日：2015-12-17

申请号：US14682624

申请日：2015-04-09

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Bo-in Noh ,  Sang-won KIM

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K1/18 ,  H05K1/03

CPC分类号： H05K1/147 ,  H01L23/5385 ,  H01L23/5387 ,  H01L24/16 ,  H01L24/32 ,  H01L24/50 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16147 ,  H01L2224/32145 ,  H01L2224/73211 ,  H01L2224/73269 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/15311 ,  H05K1/144 ,  H05K2201/043

摘要： A semiconductor package includes: a first substrate; a second substrate disposed on the first substrate to be spaced apart from the first substrate, and including an active region on which semiconductor devices are configured to be mounted; and a flexible interconnection member electrically connecting the first substrate to the second substrate, the flexible interconnection member including a flexible film and a metal wiring member formed on the flexible film.

摘要翻译： 半导体封装包括：第一基板; 第二基板，设置在与第一基板间隔开的第一基板上，并且包括有源区域，半导体器件被配置为在其上安装; 以及将第一基板电连接到第二基板的柔性互连部件，柔性互连部件包括柔性膜和形成在柔性膜上的金属布线部件。

公开(公告)号：US10020282B2

公开(公告)日：2018-07-10

申请号：US14395876

申请日：2013-04-24

申请人： NISSAN MOTOR CO., LTD. ,  Sanken Electric Co., Ltd.

发明人： Satoshi Tanimoto ,  Yusuke Zushi ,  Yoshinori Murakami ,  Kohei Matsui ,  Shinji Sato ,  Yu Fukushima

IPC分类号： H01L23/00 ,  B23K37/04 ,  H05K3/34 ,  H05K13/04

CPC分类号： H01L24/83 ,  B23K37/0426 ,  H01L24/05 ,  H01L24/29 ,  H01L24/75 ,  H01L24/97 ,  H01L2224/04026 ,  H01L2224/05082 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05639 ,  H01L2224/2732 ,  H01L2224/291 ,  H01L2224/29118 ,  H01L2224/29144 ,  H01L2224/75101 ,  H01L2224/75305 ,  H01L2224/7531 ,  H01L2224/75314 ,  H01L2224/75315 ,  H01L2224/75317 ,  H01L2224/7532 ,  H01L2224/75756 ,  H01L2224/7598 ,  H01L2224/75981 ,  H01L2224/83022 ,  H01L2224/83048 ,  H01L2224/83075 ,  H01L2224/83101 ,  H01L2224/832 ,  H01L2224/83211 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/83801 ,  H01L2224/83815 ,  H01L2224/97 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1037 ,  H01L2924/1067 ,  H01L2924/12032 ,  H01L2924/12036 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/3656 ,  H05K3/34 ,  H05K3/3431 ,  H05K13/0465 ,  H05K2203/0195 ,  H05K2203/0278 ,  H01L2924/00 ,  H01L2924/0542 ,  H01L2924/0103 ,  H01L2924/00014 ,  H01L2924/01042 ,  H01L2924/01032 ,  H01L2924/01014 ,  H01L2924/01013 ,  H01L2224/05655 ,  H01L2224/83 ,  H01L2924/00012

摘要： In a heat insulating load jig 11 of the present invention, a solder material 14 having a melting point or a solidus temperature in a range between a thermal resistance temperature of a semiconductor chip 13 and a temperature 100° C. below the thermal resistance temperature is interposed between a circuit board 12 and the semiconductor chip 13; a heat insulating body 17 is placed on an upper side of the semiconductor chip 13 in this state; a metal weight 16 is disposed on the heat insulating body 17; and load is applied to the semiconductor chip 13 while the solder material 14 is melted and solidified.

公开(公告)号：US20170018529A1

公开(公告)日：2017-01-19

申请号：US15208985

申请日：2016-07-13

申请人： Invensas Corporation

发明人： Rajesh Katkar ,  Reynaldo Co ,  Scott McGrath ,  Ashok S. Prabhu ,  Sangil Lee ,  Liang Wang ,  Hong Shen

IPC分类号： H01L25/065 ,  H01L25/00

CPC分类号： H01L25/0652 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L2224/02335 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/9222 ,  H01L2225/06506 ,  H01L2225/06555 ,  H01L2225/06582 ,  H01L2225/06589 ,  H01L2225/06596 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/18162 ,  H01L2924/19107 ,  H01L2224/19

摘要： A microelectronic assembly includes a stack of semiconductor chips each having a front surface defining a respective plane of a plurality of planes. A chip terminal may extend from a contact at a front surface of each chip in a direction towards the edge surface of the respective chip. The chip stack is mounted to substrate at an angle such that edge surfaces of the chips face a major surface of the substrate that defines a second plane that is transverse to, i.e., not parallel to the plurality of parallel planes. An electrically conductive material electrically connects the chip terminals with corresponding substrate contacts.

摘要翻译： 微电子组件包括堆叠的半导体芯片，每个半导体芯片具有限定多个平面的相应平面的前表面。 芯片端子可以沿着朝向相应芯片的边缘表​​面的方向从每个芯片的前表面处的触点延伸。 芯片堆叠以一定角度安装到基板，使得芯片的边缘表​​面面向基板的主表面，该主表面限定横向于即不平行于多个平行平面的第二平面。 导电材料将芯片端子与相应的衬底触点电连接。

公开(公告)号：US09368476B2

公开(公告)日：2016-06-14

申请号：US14811177

申请日：2015-07-28

申请人： Tessera, Inc.

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L21/44 ,  H01L25/00 ,  H01L23/00 ,  H01L21/768 ,  H01L23/48 ,  H01L25/065 ,  H01L23/31

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

公开(公告)号：US20150333050A1

公开(公告)日：2015-11-19

申请号：US14811177

申请日：2015-07-28

申请人： Tessera, Inc.

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L25/00 ,  H01L23/00 ,  H01L21/768 ,  H01L25/065

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

摘要翻译： 提供了一种微电子组件，其中分别暴露在第一和第二微电子元件的前表面处的第一和第二导电焊盘并置，每个微电子元件体现有源半导体器件。 导电元件可以在从第一微电子元件的后表面延伸到其前表面的第一开口内延伸，在从第一开口朝向第一微电子元件的前表面延伸的第二开口内，并且在第三开口 延伸穿过第一和第二垫中的至少一个以接触第一和第二垫。 第一和第二开口的内表面可分别相对于第一微电子元件的前表面在第一和第二方向上延伸，以限定大致的角度。

公开(公告)号：US09099296B2

公开(公告)日：2015-08-04

申请号：US14060997

申请日：2013-10-23

申请人： Tessera, Inc.

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L25/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

摘要翻译： 提供了一种微电子组件，其中分别暴露在第一和第二微电子元件的前表面处的第一和第二导电焊盘并置，每个微电子元件体现有源半导体器件。 导电元件可以在从第一微电子元件的后表面延伸到其前表面的第一开口内延伸，在从第一开口朝向第一微电子元件的前表面延伸的第二开口内，并且在第三开口 延伸穿过第一和第二垫中的至少一个以接触第一和第二垫。 第一和第二开口的内表面可分别相对于第一微电子元件的前表面在第一和第二方向上延伸，以限定大致的角度。

公开(公告)号：US20140048954A1

公开(公告)日：2014-02-20

申请号：US14060997

申请日：2013-10-23

申请人： Tessera, Inc.

发明人： Vage Oganesian ,  Belgacem Haba ,  Ilyas Mohammed ,  Craig Mitchell ,  Piyush Savalia

IPC分类号： H01L25/00

CPC分类号： H01L25/00 ,  H01L21/76805 ,  H01L21/76898 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/81 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/13025 ,  H01L2224/16225 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/29188 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/10253 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/15311 ,  H01L2224/83 ,  H01L2924/00

摘要： A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

摘要翻译： 提供了一种微电子组件，其中分别暴露在第一和第二微电子元件的前表面处的第一和第二导电焊盘并置，每个微电子元件体现有源半导体器件。 导电元件可以在从第一微电子元件的后表面延伸到其前表面的第一开口内延伸，在从第一开口朝向第一微电子元件的前表面延伸的第二开口内，并且在第三开口 延伸穿过第一和第二垫中的至少一个以接触第一和第二垫。 第一和第二开口的内表面可分别相对于第一微电子元件的前表面在第一和第二方向上延伸，以限定大致的角度。

公开(公告)号：US09997428B2

公开(公告)日：2018-06-12

申请号：US14799534

申请日：2015-07-14

申请人： Avago Technologies General IP (Singapore) Pte. Ltd.

发明人： Marshall Maple ,  Ashish Alawani ,  Li Sun ,  Sarah Haney

IPC分类号： H01L23/367 ,  H01L21/768 ,  H01L21/48 ,  H01L29/20 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H01L29/778 ,  H01L29/737 ,  H05K3/46 ,  H01L23/373

CPC分类号： H01L23/367 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/76816 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49827 ,  H01L29/20 ,  H01L29/737 ,  H01L29/778 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10329 ,  H01L2924/1037 ,  H01L2924/13051 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/1421 ,  H01L2924/15313 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/113 ,  H05K3/0026 ,  H05K3/4644 ,  H05K2201/09509

摘要： An apparatus, a semiconductor package including the apparatus and a method are disclosed. The apparatus includes a substrate, pluralities of vias disposed in the substrate. The vias are disposed in a hexagonal arrangement.

公开(公告)号：US09627349B2

公开(公告)日：2017-04-18

申请号：US14909157

申请日：2013-09-13

申请人： EV GROUP E. THALLNER GMBH

发明人： Markus Wimplinger

IPC分类号： H01L23/00 ,  B81C3/00

CPC分类号： H01L24/83 ,  B81C3/001 ,  B81C2203/036 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/29105 ,  H01L2224/29111 ,  H01L2224/29116 ,  H01L2224/29117 ,  H01L2224/29118 ,  H01L2224/29123 ,  H01L2224/29124 ,  H01L2224/29139 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/29157 ,  H01L2224/2916 ,  H01L2224/29166 ,  H01L2224/29169 ,  H01L2224/29171 ,  H01L2224/29184 ,  H01L2224/32145 ,  H01L2224/32507 ,  H01L2224/8302 ,  H01L2224/83022 ,  H01L2224/8381 ,  H01L2224/83894 ,  H01L2924/01003 ,  H01L2924/01005 ,  H01L2924/01011 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01034 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0105 ,  H01L2924/01052 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01322 ,  H01L2924/10251 ,  H01L2924/10252 ,  H01L2924/10253 ,  H01L2924/1026 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10323 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/10336 ,  H01L2924/10346 ,  H01L2924/1037 ,  H01L2924/10371 ,  H01L2924/10372 ,  H01L2924/10373 ,  H01L2924/10375 ,  H01L2924/10376 ,  H01L2924/10377 ,  H01L2924/10821 ,  H01L2924/10823 ,  H01L2924/10831 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/01032 ,  H01L2924/01013 ,  H01L2924/01031 ,  H01L2924/0103

摘要： A method for applying a bonding layer that is comprised of a basic layer and a protective layer on a substrate with the following method steps: application of an oxidizable basic material as a basic layer on a bonding side of the substrate, at least partial covering of the basic layer with a protective material that is at least partially dissolvable in the basic material as a protective layer. In addition, the invention relates to a corresponding substrate.