公开(公告)号：US11442491B2

公开(公告)日：2022-09-13

申请号：US15931043

申请日：2020-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung-Su Kim ,  Taekkyun Shin ,  Chun-Guan Kim ,  Yohan Kwon ,  Yun Heo

IPC: G06F1/08 ,  G06F1/26 ,  G06F9/54 ,  G06F11/30 ,  G06F1/10 ,  G06F1/3234 ,  G06F1/324 ,  G06F1/3296 ,  G06F1/3206 ,  G06F1/06 ,  G06F1/3237

Abstract: A dynamic power monitor for monitoring a power of a block in an integrated circuit is provided. The dynamic power monitor includes an input buffer configured to store first state values corresponding to internal signals of the block according to a first cycle of a clock signal; a power calculator configured to identify first power classification values corresponding to the block according to the first cycle, based on the first state values; and a filter configured to identify a first filtered value of the first power classification values.

公开(公告)号：US20240203944A1

公开(公告)日：2024-06-20

申请号：US18370650

申请日：2023-09-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Seung CHOI ,  Byung-Su Kim

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2225/06513 ,  H01L2225/06541

Abstract: A semiconductor device includes a first die including a plurality of first micro bumps on a first upper face of the first die, a plurality of first macro metal pads at positions respectively corresponding to the plurality of first micro bumps, a first routing wiring layer comprising a plurality of first routing metals, where a first end of each of the plurality of first routing metals is respectively under the plurality of first macro metal pads, a plurality of through silicon vias (TSVs), where first ends of the plurality of TSVs are respectively connected to second ends of the plurality of first routing metals, and where each of the plurality of TSVs extends downward from the respective second ends of the plurality of first routing metals, a first plurality of keep-out zones including a first keep-out zone bundle region, and a plurality of first micro metal pads.

公开(公告)号：US20210116955A1

公开(公告)日：2021-04-22

申请号：US15931043

申请日：2020-05-13

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Byung-Su Kim ,  Taekkyun Shin ,  Chun-Guan Kim ,  Yohan Kwon ,  Yun Heo

IPC: G06F1/08 ,  G06F1/26 ,  G06F11/30 ,  G06F9/54

Abstract: A dynamic power monitor for monitoring a power of a block in an integrated circuit is provided. The dynamic power monitor includes an input buffer configured to store first state values corresponding to internal signals of the block according to a first cycle of a clock signal; a power calculator configured to identify first power classification values corresponding to the block according to the first cycle, based on the first state values; and a filter configured to identify a first filtered value of the first power classification values.