公开(公告)号：US11648644B2

公开(公告)日：2023-05-16

申请号：US16517849

申请日：2019-07-22

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Eun Seok Lee ,  Ja Eung Koo ,  Kuen Byul Kim ,  Jeong Min Na ,  Chang Gil Ryu ,  Hyeon Dong Song ,  Young Seok Jang ,  Jin Suk Hong

IPC分类号： B24B53/017 ,  B24B57/02 ,  B24D13/14 ,  B24B53/12 ,  B24B37/34 ,  B24B37/10 ,  B24B21/18

CPC分类号： B24B53/017 ,  B24B37/34 ,  B24B53/12 ,  B24B57/02 ,  B24D13/145 ,  B24B21/18 ,  B24B37/105

摘要： A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.