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公开(公告)号：US20180099381A1
公开(公告)日：2018-04-12
申请号：US15726546
申请日：2017-10-06
申请人： Thomas Hülsemann
发明人： Thomas Hülsemann
摘要： A transport, driving or pressing belt, comprising at least one belt material having a lower and an upper face limited by two longitudinal edges and two transverse edges running obliquely with respect to the main extension direction of the belt, the belt material being closed and the longitudinal edges being folded down, and a method for manufacturing a transport, driving or pressing belt. To ensure high tensile strength over the complete belt length and avoid an edge tearing of the first belt material at the longitudinal edges, the transverse edges of a first belt material lie against each other in abutting relationship, and a second belt material is arranged centrically on the first belt material at least in the region of the transverse edges. The second belt material here nearly covers a width of 50% of the first belt material and is centrically glued with the first belt material.
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公开(公告)号：US09586303B2
公开(公告)日：2017-03-07
申请号：US14633907
申请日：2015-02-27
发明人： Shiguma Kato
IPC分类号： B24B49/04 , B24B37/005 , B24B37/04 , B24B21/06 , B24B21/18 , H01L21/321
CPC分类号： B24B21/18 , B24B21/06 , B24B37/005 , B24B37/04 , B24B49/04 , H01L21/321
摘要： According to one embodiment, a polishing device includes a stage, a polishing unit, a warp suppressing unit, and an adsorbing mechanism. A semiconductor wafer is mounted onto the stage. The stage is rotatable around a first shaft. The polishing unit applies a force to and polishes a rear surface of the semiconductor wafer mounted on the stage. The warp suppressing unit applies a force to, during the polishing, an outer circumferential part of a front surface of the semiconductor wafer. The adsorbing mechanism adsorbs, during the polishing, a first region in the rear surface of the semiconductor wafer. The first region is on a center side relative to an area at which the polishing is performed.
摘要翻译： 根据一个实施例，抛光装置包括台，抛光单元，翘曲抑制单元和吸附机构。 半导体晶片安装在平台上。 舞台可围绕第一轴旋转。 抛光单元对安装在平台上的半导体晶片的后表面施加力并进行抛光。 翘曲抑制单元在抛光期间对半导体晶片的正面的外周部施加力。 吸附机构在抛光期间吸附半导体晶片后表面的第一区域。 第一区域相对于进行抛光的区域在中心侧。
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公开(公告)号：US09561573B2
公开(公告)日：2017-02-07
申请号：US14167129
申请日：2014-01-29
申请人： EBARA CORPORATION
发明人： Masaya Seki , Tetsuji Togawa
CPC分类号： B24B21/002 , B24B9/065 , B24B21/004 , B24B21/18
摘要： A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
摘要翻译： 抛光装置用于抛光诸如半导体晶片的基板。 抛光装置包括用于保持基板并旋转基板的基板保持件，构造成将抛光工具压靠在基板上并对基板进行抛光的按压部件，被配置为控制按压部件的按压力的按压力控制机构 以及配置为限制按压部件的研磨位置的抛光位置限制机构。 抛光带或固定磨料用作抛光工具。
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4.发明授权Apparatus and method for blending added material with base material on a manufactured component 有权将添加的材料与基材混合在制造的部件上的装置和方法公开(公告)号：US09346145B2
公开(公告)日：2016-05-24
申请号：US13889396
申请日：2013-05-08
CPC分类号： B24B21/165 , B23P6/007 , B24B19/14 , B24B21/18
摘要： The present relates to an apparatus and method for blending added material with base material on manufactured components. The apparatus comprises an abrasive device having an abrasive surface for removing exceeding added material, and a guide fixed to the abrasive device. The method determines a trajectory of the abrasive surface with respect to a manufactured component: determines which of a plurality of contact points of the guide shall be in contact with the manufactured component along the trajectory; actuates the abrasive device; and controls position and angle of the abrasive surface en the manufactured component along the trajectory, while keeping the determined contact point in contact with the manufactured component. A force is applied to the abrasive device when the abrasive surface is in contact with the manufactured component and transferred when the guide gets in contact with the base material.
摘要翻译： 本发明涉及将添加材料与制造的部件上的基材共混的装置和方法。 该装置包括具有用于去除超过添加材料的研磨表面的研磨装置和固定到研磨装置的导向件。 该方法确定研磨表面相对于制造的部件的轨迹：确定引导件的多个接触点中的哪一个接触点将沿着轨迹与制造的部件接触; 致动研磨装置; 并且沿着所述轨迹控制所制造的部件中的研磨表面的位置和角度，同时保持所确定的接触点与所制造的部件接触。 当研磨表面与所制造的部件接触并且当导向件与基底材料接触时被传递时，力施加到研磨装置。
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公开(公告)号：US09327383B1
公开(公告)日：2016-05-03
申请号：US14622652
申请日：2015-02-13
申请人： Bor-Yann Chuang
发明人： Bor-Yann Chuang
摘要： A quick replacement device of an abrasive belt wheel is disposed on a belt sander. The belt sander has an abrasive belt wheel box. The abrasive belt wheel box is provided with two spaced fixing seats. Two ends of the abrasive belt wheel are provided with brackets relative to the fixing seats. The brackets and the fixing seats are fixed through fixing members. Through the fixing members, the abrasive belt wheel can be assembled to or disassembled from the abrasive belt wheel box quickly, providing a simple and quick replacement effect. The time to replace the abrasive belt wheel can be shortened so as to enhance work efficiency and economic efficiency.
摘要翻译： 研磨带轮的快速更换装置设置在带式砂磨机上。 皮带砂光机有砂带轮箱。 砂带轮箱设有两个间隔开的固定座。 砂带轮的两端设有相对于固定座的支架。 支架和固定座通过固定件固定。 通过固定构件，砂带轮可以快速组装到砂带箱上或拆卸，提供简单快速的更换效果。 可以缩短更换砂带轮的时间，从而提高工作效率和经济效益。
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公开(公告)号：US09321141B2
公开(公告)日：2016-04-26
申请号：US14292194
申请日：2014-05-30
摘要： The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.
摘要翻译： 本发明涉及一种用于将预定印模打磨成工件的装置。 该装置具有定位在由砂带形成的区域内的图案带。 衬垫位于由图案带形成的区域内。 在图案带的外表面上形成凸起图案。 在使用中，垫接触图案带，促使图案带的凸起图案接触砂带。 由图案带接触的砂带的部分被推向工件，使得预定的印模被砂磨入工件。
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公开(公告)号：US20160052107A1
公开(公告)日：2016-02-25
申请号：US14823967
申请日：2015-08-11
申请人： EBARA CORPORATION
发明人： Yu ISHII , Hiroyuki KAWASAKI , Masayuki NAKANISHI , Kenya ITO , Kenji KODERA , Michiyoshi YAMASHITA
IPC分类号： B24D11/00
CPC分类号： B24D11/001 , B24B9/065 , B24B21/002 , B24B21/004 , B24B21/008 , B24B21/08 , B24B21/18 , B24B27/0076 , B24B49/12 , H01L21/304 , H01L21/3105
摘要： There is disclosed a method of polishing a peripheral portion of a wafer having a hard film with use of an abrasive film while preventing damage to the abrasive film. The polishing method uses an abrasive film including a base film made of polyimide, a binder made of polyimide, and abrasive grains held by the binder. The polishing method includes: rotating a silicon substrate having a surface on which a silicon carbide film is formed; and removing the silicon carbide film from a peripheral portion of the silicon substrate by pressing the abrasive film at a low force against the silicon carbide film on the peripheral portion of the silicon substrate.
摘要翻译： 公开了一种利用磨料膜研磨具有硬质膜的晶片的周边部分的方法，同时防止对研磨膜的损伤。 抛光方法使用包括由聚酰亚胺制成的基膜，由聚酰亚胺制成的粘合剂和由粘合剂保持的磨粒的研磨膜。 抛光方法包括：旋转具有形成有碳化硅膜的表面的硅衬底; 并且通过以低的力将研磨膜压在硅衬底的周边部分上的碳化硅膜上，从硅衬底的周边部分去除碳化硅膜。
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公开(公告)号：US08998680B1
公开(公告)日：2015-04-07
申请号：US14252513
申请日：2014-04-14
申请人： Darex, LLC
发明人： Daniel T. Dovel
摘要： Apparatus and method for sharpening cutting tools. In accordance with some embodiments, an abrasive medium is presented adjacent a guide housing. The guide housing includes a guide slot to facilitate presentation of a magnetically permeable tool against the abrasive medium. A magnet positioned adjacent the guide slot exerts a biasing force upon the tool that both draws the first tool against a guide surface of the guide slot and draws the tool into the guide slot along the guide surface to hold the tool at a neutral position at which a cutting edge of the first tool applies a contacting force against the abrasive medium.
摘要翻译： 用于磨削刀具的装置和方法 根据一些实施例，研磨介质邻近导向壳体呈现。 引导壳体包括导槽，以便于将导磁工具放置在研磨介质上。 定位在引导槽附近的磁体在工具上施加偏置力，两者都将第一工具拉向引导槽的引导表面，并沿着引导表面将工具拉入引导槽中，以将工具保持在中立位置 第一工具的切削刃对研磨介质施加接触力。
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公开(公告)号：US20140349551A1
公开(公告)日：2014-11-27
申请号：US14455390
申请日：2014-08-08
摘要： The invention relates to a device and method for using same for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad is selectively controlled to contact the pattern belt, thereby urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.
摘要翻译： 本发明涉及一种用于将预定印模打磨到工件中的装置和方法。 该装置具有定位在由砂带形成的区域内的图案带。 衬垫位于由图案带形成的区域内。 在图案带的外表面上形成凸起图案。 在使用中，选择性地控制垫以接触图案带，从而促使图案带的凸起图案与砂带接触。 由图案带接触的砂带的部分被推向工件，使得预定的印模被砂磨入工件。
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公开(公告)号：US20140342639A1
公开(公告)日：2014-11-20
申请号：US14292194
申请日：2014-05-30
摘要： The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.
摘要翻译： 本发明涉及一种用于将预定印模打磨成工件的装置。 该装置具有定位在由砂带形成的区域内的图案带。 衬垫位于由图案带形成的区域内。 在图案带的外表面上形成凸起图案。 在使用中，垫接触图案带，促使图案带的凸起图案接触砂带。 由图案带接触的砂带的部分被推向工件，使得预定的印模被砂磨入工件。
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