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公开(公告)号：US20200266522A1
公开(公告)日：2020-08-20
申请号：US16789729
申请日：2020-02-13
发明人： Heecheul MOON , Kwonho SON , Chongo YOON , Mincheol SEO , Minwoo YOO
IPC分类号： H01Q1/24
摘要： An electronic device includes a housing including a first plate facing in a first direction, a second plate facing in a second direction, and a side member surrounding a space between the first plate and the second plate, a support member interposed between the first plate and the second plate and including a metallic structure, an antenna structure mounted on the support member and including a first surface facing in a third direction toward the side member, and a polymer structure disposed in a space surrounded by the first plate, the support member, the side member, and the first surface of the antenna structure, and coupled to the metallic structure. The coupled metallic structure and polymer structure includes a groove bounded by the first surface, a second surface on the polymer structure forming an acute angle with the first surface, and a third surface substantially perpendicular to the second surface.
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公开(公告)号：US20230223678A1
公开(公告)日：2023-07-13
申请号：US18119126
申请日：2023-03-08
发明人： Chaeup YOO , Hyungjin KIM , Chongo YOON , Yoonjung KIM , Taeyoon SEO
摘要： An electronic device includes: a housing; a substrate disposed in the housing; an antenna radiator; and an electrical connection member electrically interconnecting the antenna radiator and the substrate, wherein the electrical connection member includes: a plate portion including a first surface facing the antenna radiator and a second surface facing away from the first surface; a first fixing portion provided at a first end of the plate portion, the first fixing portion including a through hole and a tension structure; and a second fixing portion provided at a second end of the plate portion and electrically connecting the electrical connection member to the substrate, wherein the first fixing portion is fixed to the antenna radiator via a locking device that passes through the through hole, and wherein the tension structure is configured to contact the antenna radiator and maintain tension between the electrical connection member and the antenna radiator during fastening of the locking device.
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公开(公告)号：US20230238685A1
公开(公告)日：2023-07-27
申请号：US18117521
申请日：2023-03-06
发明人： Heecheul MOON , Sangyoup SEOK , Kwonho SON , Inkuk YUN , Sunghyup LEE , Heeseok JUNG , Chongo YOON , Jongchul CHOI
CPC分类号： H01Q1/243 , G06F1/1683 , H01Q1/38 , H01Q9/0407 , G06F1/1637
摘要： An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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4.发明申请公开(公告)号：US20220174821A1
公开(公告)日：2022-06-02
申请号：US17643003
申请日：2021-12-07
发明人： Sunghyup LEE , Chongo YOON , Kwonho SON , Mincheol SEO , Yoonjung KIM , Hyungjin KIM , Jungsik PARK , Sangyoup SEOK , Donghun SHIN , Seongyong AN , Kyungjae LEE , Heeseok JUNG , Huiwon CHO , Hyunju HONG
摘要： An electronic device according to various embodiments may include: a first frame at least partially exposed to an outside of the electronic device and comprising a metal material, a flexible printed circuit board at least a portion of which is disposed adjacent to the first frame, a first connector electrically connecting the flexible printed circuit board and a main board of the electronic device, a bendable second connector electrically connecting the flexible printed circuit board and the first frame, a bolt including a bolt body extending through a groove formed in the second connector to be bolt-coupled to a bolt groove formed in the first frame and a bolt head formed integrally with the bolt body and disposed in a first direction with respect to the first frame, a plate disposed adjacent to the bolt head of the bolt and coupled to the first frame in the first direction to allow the bolt body of the bolt to be maintained in a state of being coupled to the bolt groove formed in the first frame, and an integrated circuit disposed on the flexible printed circuit board.
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公开(公告)号：US20210280962A1
公开(公告)日：2021-09-09
申请号：US17327022
申请日：2021-05-21
发明人： Kyungbin KIM , Chongo YOON , Sumin YUN , Hyunseock ROH , Gyubok PARK , Jinwoo JUNG , Jaebong CHUN , Hochul HWANG
摘要： An electronic device is provided. The electronic device includes a housing structure that includes a ceramic portion including a ceramic material, and a polymer portion formed on an inner surface of the ceramic portion and including a polymer material, and an antenna structure that is disposed within the housing structure and radiates a radio frequency (RF) signal to an outside of the housing structure. The housing structure includes a first portion including at least a portion of a region through which the RF signal passes, and a second portion formed around the first portion. In the first portion, a ratio of a thickness of the polymer portion to an entire thickness of the first portion is a first ratio. In the second portion, a ratio of a thickness of the polymer portion to an entire thickness of the second portion is a second ratio.
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公开(公告)号：US20210126347A1
公开(公告)日：2021-04-29
申请号：US17082520
申请日：2020-10-28
发明人： Kyungbin KIM , Chongo YOON , Sumin YUN , Hyunseock ROH , Gyubok PARK , Jinwoo JUNG , Jaebong CHUN , Hochul HWANG
摘要： An electronic device is provided. The electronic device includes a housing structure that includes a ceramic portion including a ceramic material, and a polymer portion formed on an inner surface of the ceramic portion and including a polymer material, and an antenna structure that is disposed within the housing structure and radiates a radio frequency (RF) signal to an outside of the housing structure. The housing structure includes a first portion including at least a portion of a region through which the RF signal passes, and a second portion formed around the first portion. In the first portion, a ratio of a thickness of the polymer portion to an entire thickness of the first portion is a first ratio. In the second portion, a ratio of a thickness of the polymer portion to an entire thickness of the second portion is a second ratio.
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公开(公告)号：US20210083366A1
公开(公告)日：2021-03-18
申请号：US17106235
申请日：2020-11-30
发明人： Heecheul MOON , Sangyoup SEOK , Kwonho SON , Inkuk YUN , Sunghyup LEE , Heeseok JUNG , Chongo YOON , Jongchul CHOI
摘要： An electronic device in accordance with an example embodiment of the disclosure includes a first non-conductive cover defining a first surface of the electronic device, a second non-conductive cover including a first portion defining a second surface of the electronic device, and a second portion defining one portion of a lateral surface of the electronic device, a conductive frame defining an other portion of the lateral surface of the electronic device, and an antenna module, wherein the antenna module is positioned so that the one surface is substantially perpendicular to the second surface at a position within a specified proximity to the lateral surface of the electronic device and is configured to transmit and/or receive a signal through the lateral surface.
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8.发明公开公开(公告)号：US20230307821A1
公开(公告)日：2023-09-28
申请号：US18327369
申请日：2023-06-01
发明人： Chongo YOON , Sunghyup LEE , Kwonho SON , Mincheol SEO , Yoonjung KIM , Hyungjin KIM , Jungsik PARK , Sangyoup SEOK , Donghun SHIN , Seongyong AN , Kyungjae LEE , Huiwon CHO , Heeseok JUNG , Hyunju HONG
摘要： An electronic device may include: a main substrate; a frame having at least one part exposed outside the electronic device, and formed from a metal material; a flexible printed circuit board having at least one part disposed adjacent to the frame; a first connecting part for electrically connecting the flexible printed circuit board and the main substrate; a second connecting part formed to be bendable to electrically connect the flexible printed circuit board and the frame; and an integrated circuit disposed on, directly or indirectly, the flexible printed circuit board. Various other embodiments are possible.
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公开(公告)号：US20220344837A1
公开(公告)日：2022-10-27
申请号：US17860850
申请日：2022-07-08
发明人： Kyungbin KIM , Kwangseo KIM , Jiho KIM , Seongyong AN , Chongo YOON , Gyubok PARK , Jinwoo JUNG
摘要： An electronic device includes a housing including an internal space, a display disposed in the internal space, the display being visible from an outside of the electronic device through at least a part of the housing, at least one first antenna disposed in the internal space, a second antenna disposed in the internal space and wound multiple times and including a conductive pattern disposed to be spaced apart from the first antenna, a first wireless communication circuit configured to transmit or receive a wireless signal in a first frequency band via the at least one first antenna, and a second wireless communication circuit configured to transmit or receive a wireless signal in a second frequency band via the second antenna, wherein the at least one first antenna is spaced apart by a distance from the conductive pattern.
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公开(公告)号：US20210298174A1
公开(公告)日：2021-09-23
申请号：US17260320
申请日：2019-08-06
发明人： Hoyoung LEE , Chongo YOON , Sunghyup LEE
摘要： An electronic device is disclosed. The electronic device may comprise: a housing having a first dielectric constant and including a first part; a substrate disposed inside the housing and including a communication module disposed on the surface thereof opposite to the first part; and a ceramic layer formed between the substrate and the first part to cover the communication module, wherein the first part and the ceramic layer are formed to have a second dielectric constant different from the first dielectric constant. Various other embodiments understood through the specification are possible.
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