公开(公告)号：US20140014975A1

公开(公告)日：2014-01-16

申请号：US13837757

申请日：2013-03-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jong-kon BAE ,  Won-sik KANG ,  Jae-hyuck WOO ,  Sung-ki KIM ,  Yang-hyo KIM ,  Do-kyung KIM

IPC: H01L23/367 ,  H01L33/64

CPC classification number: H01L23/3677 ,  H01L23/367 ,  H01L23/5226 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A semiconductor chip includes a circuit region having an integrated semiconductor circuit on a semiconductor substrate, and a heat radiation member on at least a portion of a scribe lane region configured to at least partially surround the circuit region, the heat radiation member including a plurality of heat radiation fins that extend in a direction orthogonal to an upper surface of the semiconductor substrate.

Abstract translation: 半导体芯片包括在半导体衬底上具有集成半导体电路的电路区域，以及至少部分地构成为至少部分地围绕电路区域的划线通道区域的至少一部分上的散热构件，该散热构件包括多个 散热翅片，其在与半导体基板的上表面正交的方向上延伸。