公开(公告)号：US11004754B2

公开(公告)日：2021-05-11

申请号：US16683397

申请日：2019-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin-Yeol Yang ,  Hyung-Su Son ,  Hae-Gu Lee ,  Dong-Su Han

IPC: H01L21/66 ,  H01L21/78 ,  B23K26/359 ,  G01N23/20 ,  B23K26/03 ,  B23K26/00 ,  B23K26/08 ,  B23K26/0622 ,  B23K26/53 ,  B23K103/00 ,  H01L21/263 ,  H01L21/683 ,  B23K101/40 ,  H01L21/304

Abstract: A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.