公开(公告)号：US10809135B2

公开(公告)日：2020-10-20

申请号：US15883340

申请日：2018-01-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Seung Bum Choi ,  Joo Hyun Kim ,  Soo Hyun Park ,  Doo Sun Yoon ,  Min Woo Yoo ,  Jong Chul Choi

IPC: G01K11/00 ,  G01K5/52 ,  H01M10/42 ,  G01K13/00 ,  G01K7/22 ,  H01M10/48

Abstract: An electronic device is provided. The electronic device includes a substrate, a coil unit comprising a coil disposed on a specified area of the substrate and configured to transmit or receive a signal, a first terminal, a second terminal, and a temperature sensor configured to detect temperature. The temperature sensor has a wire form and is disposed between the first terminal and the second terminal along at least part of a peripheral area of the substrate.

公开(公告)号：US10440470B2

公开(公告)日：2019-10-08

申请号：US15892047

申请日：2018-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo Hyun Park ,  Joo Hyun Kim ,  Doo Sun Yoon ,  Seung Bum Choi ,  Min Woo Yoo ,  Jong Chul Choi

IPC: H04R1/42 ,  H04R1/02 ,  H04R1/44 ,  H04R1/28 ,  H04R29/00

Abstract: Disclosed is an electronic device including a housing; a speaker configured to output a sound signal; an enclosure surrounding the speaker and including a pipe passage, through which the sound signal moves in a direction facing an opening formed in the housing; a heat emitting structure mounted on an inner surface or an outer surface of the enclosure; a sealing member attached to the pipe passage; and a processor physically or electrically connected to the heat emitting structure and configured to control emission of heat.

公开(公告)号：US20180227668A1

公开(公告)日：2018-08-09

申请号：US15892047

申请日：2018-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo Hyun Park ,  Joo Hyun Kim ,  Doo Sun Yoon ,  Seung Bum Choi ,  Min Woo Yoo ,  Jong Chul Choi

IPC: H04R1/42 ,  H04R1/02 ,  H04R1/28

CPC classification number: H04R1/42 ,  H04R1/028 ,  H04R1/2857 ,  H04R1/44 ,  H04R29/001 ,  H04R2201/02 ,  H04R2499/11

Abstract: Disclosed is an electronic device including a housing; a speaker configured to output a sound signal; an enclosure surrounding the speaker and including a pipe passage, through which the sound signal moves in a direction facing an opening formed in the housing; a heat emitting structure mounted on an inner surface or an outer surface of the enclosure; a sealing member attached to the pipe passage; and a processor physically or electrically connected to the heat emitting structure and configured to control emission of heat.