公开(公告)号：US11856700B2

公开(公告)日：2023-12-26

申请号：US17225209

申请日：2021-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chunghyun Ryu ,  Byungok Kang ,  Su-Yong An ,  Jongwoo Jang ,  Insub Kwak ,  Teck Su Oh ,  Geurim Jung ,  Sang-Ho Park ,  Sung-Ki Lee

IPC: H01G9/08 ,  H05K1/18 ,  H01G9/008 ,  H01G9/045

CPC classification number: H05K1/182 ,  H01G9/08 ,  H01G9/008 ,  H01G9/045 ,  H05K2201/09063 ,  H05K2201/09781 ,  H05K2201/10015

Abstract: A capacitor module horizontally mounted on a PCB and including a case including a first side surface, an opposing second side, a first electrode pad and a second electrode pad disposed at the first side surface, and a third electrode pad disposed at the second side surface, and an electrolytic capacitor including a dielectric extending in a first horizontal direction, a first electrode contacting the first electrode pad and a second electrode contacting the second electrode pad, wherein the first electrode pad is spaced apart from second electrode pad in a second horizontal direction.