公开(公告)号：US20190115325A1

公开(公告)日：2019-04-18

申请号：US15968143

申请日：2018-05-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Hyeok IM ,  Hee Seok LEE ,  Tae Woo KANG ,  Yeong Seok KIM ,  Kyoung-Min LEE

IPC: H01L25/10 ,  H01L23/367 ,  H01L23/538 ,  H01L23/498

Abstract: The semiconductor package including a first semiconductor package including a first semiconductor package substrate, and a first semiconductor chip on the first semiconductor package substrate, an interposer disposed on the first semiconductor package is provided. Interposer electrically connects the first semiconductor package with an external semiconductor package, and has first and second sides opposed to each other. The second side is located between the first side and the first semiconductor package substrate, a first recess is formed in the second side of the interposer. The first recess has side walls extended from the second side toward the first side of the interposer and an upper surface connected to the side walls and the upper surface of the first recess faces the first semiconductor chip and a via in the interposer. The via does not transmit an electrical signal between the first semiconductor package and the external semiconductor package.

公开(公告)号：US20190295998A1

公开(公告)日：2019-09-26

申请号：US16439409

申请日：2019-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Hyeok IM ,  Hee Seok LEE ,  Taek Kyun SHIN ,  Cha Jea JO

IPC: H01L25/10 ,  H01L21/48 ,  H01L23/13 ,  H01L23/31 ,  H01L21/683 ,  H01L29/06 ,  H01L23/538 ,  H01L23/498 ,  H01L21/56

Abstract: A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole.

公开(公告)号：US20180315740A1

公开(公告)日：2018-11-01

申请号：US15849767

申请日：2017-12-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun Hyeok IM ,  Hee Seok LEE ,  Taek Kyun SHIN ,  Cha Jea JO

IPC: H01L25/10 ,  H01L23/538 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor device package includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the first portion is inserted into the first interposer hole.