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    METHOD OF RECOGNIZING CONTACTLESS USER INTERFACE MOTION AND SYSTEM THERE-OF
    1.
    发明申请
    METHOD OF RECOGNIZING CONTACTLESS USER INTERFACE MOTION AND SYSTEM THERE-OF 有权
    识别无缝用户界面运动的方法及其系统

    公开(公告)号：US20140078048A1

    公开(公告)日：2014-03-20

    申请号：US14030099

    申请日：2013-09-18

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Myoung Seok KONG ,  Hyun Woo PARK ,  Taek Kyun SHIN

    IPC: G06F3/03

    CPC classification number: G06F3/0304 ,  G06F3/011 ,  G06F3/0325

    Abstract: A contactless user-interface (UI) motion recognizing device and method of controlling the same are provided. The method includes: obtaining a left-eye image and a right-eye image; determining an object position of an object in the obtained left-eye image and the obtained right-eye image; determining an object brightness of the object; determining depth information of the object using the determined object brightness; determining a three-dimensional (3D) object position of the object using the determined object position and the determined depth information; determining an object moving velocity based on the determined 3D object position and a previous 3D object position; and determining a UI pattern based on the determined 3D object position and the determined object moving velocity, and executing an operation according to the determined UI pattern.

    Abstract translation: 提供了一种非接触式用户界面（UI）运动识别装置及其控制方法。 该方法包括：获得左眼图像和右眼图像; 确定所获得的左眼图像和所获得的右眼图像中的对象的对象位置; 确定物体的物体亮度; 使用确定的对象亮度确定对象的深度信息; 使用所确定的对象位置和确定的深度信息来确定对象的三维（3D）对象位置; 基于所确定的3D对象位置和先​​前的3D对象位置来确定对象移动速度; 以及基于所确定的3D对象位置和所确定的对象移动速度来确定UI模式，以及根据所确定的UI模式执行操作。

    SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME
    2.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND APPARATUS COMPRISING THE SAME 审中-公开

    公开(公告)号：US20190295998A1

    公开(公告)日：2019-09-26

    申请号：US16439409

    申请日：2019-06-12

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yun Hyeok IM ,  Hee Seok LEE ,  Taek Kyun SHIN ,  Cha Jea JO

    IPC: H01L25/10 ,  H01L21/48 ,  H01L23/13 ,  H01L23/31 ,  H01L21/683 ,  H01L29/06 ,  H01L23/538 ,  H01L23/498 ,  H01L21/56

    Abstract: A semiconductor device package and a semiconductor apparatus are provided. The semiconductor device includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the second portion is inserted into the first interposer hole.

    SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
    3.
    发明申请
    SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME 审中-公开

    公开(公告)号：US20180315740A1

    公开(公告)日：2018-11-01

    申请号：US15849767

    申请日：2017-12-21

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Yun Hyeok IM ,  Hee Seok LEE ,  Taek Kyun SHIN ,  Cha Jea JO

    IPC: H01L25/10 ,  H01L23/538 ,  H01L23/498 ,  H01L23/13 ,  H01L21/48 ,  H01L21/56

    Abstract: A semiconductor device package includes a first semiconductor package, a second semiconductor package, and an interposer between the first and second semiconductor packages. The first semiconductor package includes a first semiconductor package substrate and a first semiconductor chip. The second semiconductor package includes a second semiconductor package substrate and a second semiconductor chip. The interposer electrically connects the first semiconductor package to the second semiconductor package and includes a first interposer hole passing through the interposer. The first semiconductor chip includes a second portion which protrudes from a first portion, and the first portion is inserted into the first interposer hole.

    DISPLAY DRIVING CIRCUIT AND DISPLAY DEVICE THEREOF
    4.
    发明公开
    DISPLAY DRIVING CIRCUIT AND DISPLAY DEVICE THEREOF 审中-公开

    公开(公告)号：US20240153435A1

    公开(公告)日：2024-05-09

    申请号：US18475793

    申请日：2023-09-27

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jun-Hong PARK ,  Oh Jae KWON ,  Suk Ki MIN ,  Taek Kyun SHIN ,  Doo-Hee LIM ,  Young Ho CHOI

    IPC: G09G3/20 ,  G09G3/3275 ,  G09G3/36

    CPC classification number: G09G3/2096 ,  G09G3/3275 ,  G09G3/3685 ,  G09G2310/08 ,  G09G2330/06

    Abstract: A display driving circuit is provided. The display driving circuit includes a timing controller configured to output image data and a source control signal, a first source driver circuit configured to output first source data of the image data by activating a plurality of first data lines in accordance with the source control signal, the first data lines having a first output spreading time, a second source driver circuit configured to output second source data of the image data by activating a plurality of second data lines in accordance with the source control signal, the second data lines having a second output spreading time, and a third source driver circuit configured to output third source data of the image data by activating a plurality of third data lines in accordance with the source control signal, the third data lines having a third output spreading time, wherein the first output spreading time, the second output spreading time and the third output spreading time do not overlap.

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