公开(公告)号：US11436176B2

公开(公告)日：2022-09-06

申请号：US16734844

申请日：2020-01-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyungsoo Lee ,  Jaewon Lee ,  Junho Huh ,  Helin Lin

IPC: G06F13/40 ,  G06F9/4401 ,  G06F13/24 ,  G06F13/42

Abstract: A semiconductor integrated circuit includes a central processing unit, a hardware function block that outputs a plurality of hardware signals to be transmitted to an external device independently of the central processing unit, a virtual general purpose input/output (GPIO) finite state machine that transforms the plurality of hardware signals to a virtual GPIO payload, and an I3C communication block that transmits the virtual GPIO payload to the external device through a serial data line and a serial clock line.