公开(公告)号：US20130297948A1

公开(公告)日：2013-11-07

申请号：US13718382

申请日：2012-12-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heon Soo LEE ,  Hong-Mook CHOI ,  Sang-Hyun PARK

IPC: G06F21/60

CPC classification number: G06F21/72 ,  G06F3/0619 ,  G06F3/0655 ,  G06F3/0679 ,  G06F13/28 ,  G06F21/602 ,  G06F21/74 ,  G06F21/85 ,  G06F2206/1014 ,  H04L9/0822 ,  H04L2209/12

Abstract: A method of operating a system on chip (SoC) includes converting plain data into cipher data by using an encryption key and transmitting the cipher data directly to a memory controller which controls an operation of a non-volatile memory. The encryption key may be output by a one-time programmable (OTP) memory.

公开(公告)号：US20150372816A1

公开(公告)日：2015-12-24

申请号：US14713120

申请日：2015-05-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Heon Soo LEE ,  Yong Ki LEE ,  Sang Hyun PARK ,  Mi Jung NOH ,  Hong Mook CHOI ,  Dong Jin PARK ,  Woo Hyung CHUN

IPC: H04L9/14 ,  G06F13/42 ,  G06F21/60

CPC classification number: H04L9/14 ,  G06F13/4282 ,  G06F21/606 ,  G06F21/84 ,  G06F21/85 ,  G09C1/00 ,  H04L9/088 ,  H04L2209/12

Abstract: A semiconductor device may include: a bus; first and second function modules configured to communicate via the bus; a first encryption module configured to encrypt first data output from the first function module using a first encryption key to generate first encrypted data; and/or a second encryption module configured to decrypt the first encrypted data using the first encryption key, to output the decrypted first data to the second function module, and to encrypt second data output from the second function module using a second encryption key to generate second encrypted data. A semiconductor device may include: a bus; first and second modules configured to communicate via the bus; and/or an encryption module configured to use different encryption policies for first data, which is output from the first module and stored in a memory, and second data, which is output from the second module and stored in the memory.

Abstract translation: 半导体器件可以包括：总线; 配置为经由总线通信的第一和第二功能模块; 第一加密模块，被配置为使用第一加密密钥来加密从所述第一功能模块输出的第一数据，以生成第一加密数据; 和/或第二加密模块，被配置为使用第一加密密钥对第一加密数据进行解密，以将解密的第一数据输出到第二功能模块，并且使用第二加密密钥来加密从第二功能模块输出的第二数据，以产生 第二个加密数据。 半导体器件可以包括：总线; 第一和第二模块经配置以经由总线进行通信; 和/或被配置为对从第一模块输出并存储在存储器中的第一数据使用不同的加密策略的加密模块以及从第二模块输出并存储在存储器中的第二数据。