公开(公告)号：US20170209960A1

公开(公告)日：2017-07-27

申请号：US15281578

申请日：2016-09-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoung Whan OH ,  Yeon Woo CHOI ,  In Hwan KIM ,  Won Ki PARK ,  Ho Youl LEE ,  Yong Won CHOI

IPC: B23K26/08 ,  B23K26/402 ,  B23K26/03 ,  B23K26/38 ,  H01L21/67 ,  H01L21/78

CPC classification number: B23K26/0876 ,  B23K26/03 ,  B23K26/032 ,  B23K26/38 ,  B23K26/402 ,  B23K2101/40 ,  B23K2103/56 ,  H01L21/67092 ,  H01L21/67259 ,  H01L21/78

Abstract: A wafer cutting apparatus includes a stage to support a wafer, a cutter, and a sensor. The cutter irradiates the wafer with a beam in a first direction to cut the wafer. The sensor is spaced apart from the cutter in a second direction different from the first direction, and measures a spaced distance between the wafer and the cutter. The sensor measures the spaced distance between the wafer and the cutter along a second cutting line parallel to a first cutting line while the cutter cuts the wafer along the first cutting line on the wafer.