公开(公告)号：US20230170304A1

公开(公告)日：2023-06-01

申请号：US18095900

申请日：2023-01-11

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sunkyoung SEO ,  Taehwan KIM ,  Hyunjung SONG ,  Hyoeun KIm ,  Wonil LEE ,  Sanguk HAN

IPC: H01L23/538 ,  H01L23/00 ,  H01L23/367

CPC classification number: H01L23/5384 ,  H01L24/14 ,  H01L23/367 ,  H01L23/5385 ,  H01L23/5386

Abstract: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.