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公开(公告)号:US20210028102A1
公开(公告)日:2021-01-28
申请号:US16809116
申请日:2020-03-04
发明人: Seunghoon Yeon , Wonil LEE , Yonghoe CHO
IPC分类号: H01L23/522 , H01L23/498 , H01L23/48 , H01L23/00
摘要: A semiconductor package includes a semiconductor device having a through silicon via, a lower redistribution structure on the semiconductor device, the lower redistribution structure including a lower redistribution insulating layer and a lower redistribution pattern electrically connected to the through silicon via, a package connection terminal on the lower redistribution structure and electrically connected to the lower redistribution pattern, an upper redistribution structure on the semiconductor device and including an upper redistribution insulating layer and an upper redistribution pattern electrically connected to the through silicon via, a conductive via in contact with the upper redistribution pattern and on the upper redistribution insulating layer, a connection pad on the conductive via, and a passive element pattern on the upper redistribution structure and electrically connected to the conductive via.
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公开(公告)号:US20230284297A1
公开(公告)日:2023-09-07
申请号:US18316751
申请日:2023-05-12
发明人: Jeongyeob OAK , Sejin PARK , Jisoo SONG , Wonil LEE
摘要: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.
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公开(公告)号:US20230170304A1
公开(公告)日:2023-06-01
申请号:US18095900
申请日:2023-01-11
发明人: Sunkyoung SEO , Taehwan KIM , Hyunjung SONG , Hyoeun KIm , Wonil LEE , Sanguk HAN
IPC分类号: H01L23/538 , H01L23/00 , H01L23/367
CPC分类号: H01L23/5384 , H01L24/14 , H01L23/367 , H01L23/5385 , H01L23/5386
摘要: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.
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公开(公告)号:US20210193581A1
公开(公告)日:2021-06-24
申请号:US17003639
申请日:2020-08-26
发明人: Sunkyoung SEO , Taehwan KIM , Hyunjung SONG , Hyoeun KIM , Wonil LEE , Sanguk HAN
IPC分类号: H01L23/538 , H01L23/00 , H01L23/367
摘要: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.
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公开(公告)号:US20230317654A1
公开(公告)日:2023-10-05
申请号:US17980740
申请日:2022-11-04
发明人: Jihoon KIM , Minki KIM , Wonil LEE , Hyuekjae LEE
IPC分类号: H01L23/00 , H01L25/065 , H01L25/18 , H01L25/00
CPC分类号: H01L24/08 , H01L25/0657 , H01L25/18 , H01L24/05 , H01L24/80 , H01L25/50 , H01L2224/05013 , H01L2224/05015 , H01L2224/05017 , H01L2224/05147 , H01L2224/08145 , H01L2224/80031 , H01L2224/80895 , H01L2224/80896 , H01L2924/1431 , H01L2924/14511
摘要: Disclosed are semiconductor devices and their fabrication methods. The semiconductor device comprises lower and upper structures. The lower structure includes a first semiconductor substrate, a first pad, and a first dielectric layer. The upper structure includes a second semiconductor substrate, a second pad, and a second dielectric layer. The upper and lower structures are bonded to each other to allow the first and second pads to come into contact each other and to allow the first and second dielectric layers to come into contact each other. A first interface between the first and second pads is at a level different from that of a second interface between the first and second dielectric layers. A first area of the first pad is greater than a second area of the second pad. A second thickness of the second pad is different from a first thickness of the first pad.
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公开(公告)号:US20230141447A1
公开(公告)日:2023-05-11
申请号:US17896638
申请日:2022-08-26
发明人: Wonil LEE , Minki KIM , Jihoon KIM , Gwangjae JEON
IPC分类号: H01L23/00 , H01L25/065
CPC分类号: H01L24/05 , H01L24/08 , H01L24/03 , H01L24/80 , H01L24/97 , H01L24/94 , H01L25/0652 , H01L25/0657 , H01L2224/16227 , H01L2224/16238 , H01L24/16 , H01L2224/95001 , H01L2224/03616 , H01L2224/80204 , H01L2224/80895 , H01L2224/80896 , H01L2225/06524 , H01L2225/06527 , H01L2225/06544 , H01L2924/35121 , H01L2924/1434 , H01L2924/1431 , H01L2224/08121 , H01L2224/08145 , H01L2224/05018 , H01L2224/05073 , H01L2224/05541 , H01L2224/05555 , H01L2224/05015 , H01L2224/05557 , H01L2224/05578 , H01L2224/05687 , H01L2224/05647 , H01L2224/05166 , H01L2224/05187
摘要: A semiconductor package is provided in which a first insulating layer includes a first recess spaced apart from a first pad in a first direction, and a second insulating layer includes a second recess spaced apart from a second pad in the first direction and overlapping at least a portion of the first recess in a second direction, perpendicular to the first direction, to provide an air gap together with the first recess. The semiconductor package further includes a first bonding surface defined by the first and second insulating layers contacting each other on one side of the air gap, adjacent to the first and second pads, and a second bonding surface defined by the first and second insulating layers contacting each other on another side of the air gap, opposite to the one side.
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公开(公告)号:US20240365405A1
公开(公告)日:2024-10-31
申请号:US18771378
申请日:2024-07-12
发明人: Jeongyeob OAK , Sejin PARK , Jisoo SONG , Wonil LEE
摘要: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.
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公开(公告)号:US20220279409A1
公开(公告)日:2022-09-01
申请号:US17751163
申请日:2022-05-23
发明人: Jeongyeob OAK , Jisoo SONG , Wonil LEE
摘要: A method and apparatus are provided that controls the handover between DUs in an eNB including a CU and a DU. The method and system fuses 5G communication systems with IoT technology to transmission data at a high rate after 4G systems. The communication method and system is applied to intelligent services, based on 5G communication technology and IoT related technology. The method includes transmitting, to a source DU of the base station, a first message related to a handover; receiving, from the source DU, a second message for downlink data delivery information related to a PDU transmitted from the source DU to a terminal; receiving, from a target DU of the base station, a third message based on a random access procedure of the terminal toward the target DU; and transmitting, to the target DU, downlink data based on the downlink data delivery information after receiving the third message.
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公开(公告)号:US20220030643A1
公开(公告)日:2022-01-27
申请号:US17497580
申请日:2021-10-08
发明人: Jeongyeob OAK , Sejin PARK , Jisoo SONG , Wonil LEE
摘要: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.
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10.
公开(公告)号:US20210168597A1
公开(公告)日:2021-06-03
申请号:US16624064
申请日:2018-06-05
发明人: Janghee LEE , Sejin PARK , Wonil LEE
IPC分类号: H04W12/037 , H04W12/106 , H04W76/19 , H04W36/08 , H04W80/02
摘要: Disclosed is a fifth generation (5G) or pre-5G communication system for supporting data transmission rate higher than that of a fourth generation (4G) communication system such as long term evolution (LTE). The objective of the present disclosure is to detect a mismatch of an encryption parameter in a wireless communication system, and an operating method of a reception end comprises the steps of: receiving, from a transmission end, a packet including information related to a serial number of the packet and an encryption parameter determined on the basis of the serial number; determining whether the encryption parameter determined by the reception end is mismatched, on the basis of the information related to the serial number and the encryption parameter.
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