SEMICONDUCTOR PACKAGES
    1.
    发明申请

    公开(公告)号:US20210028102A1

    公开(公告)日:2021-01-28

    申请号:US16809116

    申请日:2020-03-04

    摘要: A semiconductor package includes a semiconductor device having a through silicon via, a lower redistribution structure on the semiconductor device, the lower redistribution structure including a lower redistribution insulating layer and a lower redistribution pattern electrically connected to the through silicon via, a package connection terminal on the lower redistribution structure and electrically connected to the lower redistribution pattern, an upper redistribution structure on the semiconductor device and including an upper redistribution insulating layer and an upper redistribution pattern electrically connected to the through silicon via, a conductive via in contact with the upper redistribution pattern and on the upper redistribution insulating layer, a connection pad on the conductive via, and a passive element pattern on the upper redistribution structure and electrically connected to the conductive via.

    METHOD AND DEVICE FOR COMMUNICATION BETWEEN NETWORK ENTITIES IN CLOUD LAN ENVIRONMENT

    公开(公告)号:US20230284297A1

    公开(公告)日:2023-09-07

    申请号:US18316751

    申请日:2023-05-12

    IPC分类号: H04W76/10 H04L67/10 H04W72/04

    摘要: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.

    SEMICONDUCTOR PACKAGE
    3.
    发明公开

    公开(公告)号:US20230170304A1

    公开(公告)日:2023-06-01

    申请号:US18095900

    申请日:2023-01-11

    摘要: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.

    SEMICONDUCTOR PACKAGE
    4.
    发明申请

    公开(公告)号:US20210193581A1

    公开(公告)日:2021-06-24

    申请号:US17003639

    申请日:2020-08-26

    摘要: A semiconductor package includes a package substrate, a lower semiconductor device arranged on the package substrate and including first through electrodes, first lower connection bumps arranged between the package substrate and the lower semiconductor device and electrically connecting the package substrate to the first through electrodes, a connecting substrate arranged on the package substrate and including second through electrodes, second lower connection bumps arranged between the package substrate and the connecting substrate and electrically connecting the package substrate to the second through electrodes, and an upper semiconductor device arranged on the lower semiconductor device and electrically connected to the first through electrodes and the second through electrodes.

    METHOD AND DEVICE FOR COMMUNICATION BETWEEN NETWORK ENTITIES IN CLOUD LAN ENVIRONMENT

    公开(公告)号:US20240365405A1

    公开(公告)日:2024-10-31

    申请号:US18771378

    申请日:2024-07-12

    摘要: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.

    METHOD AND APPARATUS FOR CONTROLLING HANDOVER IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20220279409A1

    公开(公告)日:2022-09-01

    申请号:US17751163

    申请日:2022-05-23

    IPC分类号: H04W36/08 H04W36/00

    摘要: A method and apparatus are provided that controls the handover between DUs in an eNB including a CU and a DU. The method and system fuses 5G communication systems with IoT technology to transmission data at a high rate after 4G systems. The communication method and system is applied to intelligent services, based on 5G communication technology and IoT related technology. The method includes transmitting, to a source DU of the base station, a first message related to a handover; receiving, from the source DU, a second message for downlink data delivery information related to a PDU transmitted from the source DU to a terminal; receiving, from a target DU of the base station, a third message based on a random access procedure of the terminal toward the target DU; and transmitting, to the target DU, downlink data based on the downlink data delivery information after receiving the third message.

    METHOD AND DEVICE FOR COMMUNICATION BETWEEN NETWORK ENTITIES IN CLOUD LAN ENVIRONMENT

    公开(公告)号:US20220030643A1

    公开(公告)日:2022-01-27

    申请号:US17497580

    申请日:2021-10-08

    IPC分类号: H04W76/10 H04L29/08 H04W72/04

    摘要: The present disclosure relates to a research that has been conducted with the support of the “Cross-Departmental Giga KOREA Project” funded by the government (the Ministry of Science and ICT) in 2017 (No. GK17N0100, millimeter wave 5G mobile communication system development). The present disclosure relates to a communication technique for convergence of a 5G communication system for supporting a higher data transmission rate beyond a 4G system with an IoT technology, and a system therefor. The present disclosure may be applied to an intelligent service (for example, smart home, smart building, smart city, smart car or connected car, health care, digital education, retail business, security and safety-related service, etc.) on the basis of a 5G communication technology and an IoT-related technology.

    DEVICE AND METHOD FOR DETECTING MISMATCH OF ENCRYPTION PARAMETER IN WIRELESS COMMUNICATION SYSTEM

    公开(公告)号:US20210168597A1

    公开(公告)日:2021-06-03

    申请号:US16624064

    申请日:2018-06-05

    摘要: Disclosed is a fifth generation (5G) or pre-5G communication system for supporting data transmission rate higher than that of a fourth generation (4G) communication system such as long term evolution (LTE). The objective of the present disclosure is to detect a mismatch of an encryption parameter in a wireless communication system, and an operating method of a reception end comprises the steps of: receiving, from a transmission end, a packet including information related to a serial number of the packet and an encryption parameter determined on the basis of the serial number; determining whether the encryption parameter determined by the reception end is mismatched, on the basis of the information related to the serial number and the encryption parameter.