-
1.
公开(公告)号:US20230100573A1
公开(公告)日:2023-03-30
申请号:US17742184
申请日:2022-05-11
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: WONSEB JEONG , HEE HYUN NAM , YOUNGGEON YOO , JEONGHO LEE , YOUNHO JEON , IPOOM JEONG , CHANHO YOON
IPC: G06F3/06
Abstract: A memory device includes; a first memory of first type, a second memory of second type different from the first type, and a memory controller. The memory controller receives an access request and workload information related to work of an external processor, processes the access request using the workload information, and accesses at least one of the first memory and the second memory in response to the access request.