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1.发明授权Semiconductor manufacturing apparatus and semiconductor device manufacturing method using the same 有权半导体制造装置及使用其的半导体装置的制造方法公开(公告)号：US09564298B2
公开(公告)日：2017-02-07
申请号：US14543897
申请日：2014-11-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ju-hee Lee , Su-ho Lee , Won-hyuk Jang , Jae-beom Park , Ik-soo Kim , Myoung-woon Kim
IPC: H01J37/32
CPC classification number: H01J37/3288 , H01J37/32577 , H01J37/32908
Abstract: A semiconductor manufacturing apparatus may include a chamber accommodating a substrate to be processed, a first electrode providing electric field in the chamber and a second electrode opposing to the first electrode, and a first power transmitting rod connected to one of the first electrode and the second electrode. A conductive stress attenuating unit may be formed in the first power transmitting rod. Methods of manufacturing semiconductor devices using the semiconductor manufacturing apparatus are also disclosed.
Abstract translation: 半导体制造装置可以包括容纳要处理的基板的腔室，在腔室中提供电场的第一电极和与第一电极相对的第二电极，以及连接到第一电极和第二电极之一的第一电力传输杆 电极。 可以在第一动力传递杆中形成导电应力衰减单元。 还公开了使用半导体制造装置制造半导体器件的方法。
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公开(公告)号：US11954626B2
公开(公告)日：2024-04-09
申请号：US17046935
申请日：2018-05-04
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Jae-hong Kim , Myung-jin Eom , Ik-soo Kim , Sang-kyung Lee , Hee-won Jin
CPC classification number: G06Q10/06316 , F25D29/005 , G06F9/453 , G06F9/542 , G06F18/22 , G06V20/64
Abstract: Disclosed are a refrigerator and a method for displaying a user interface on the refrigerator, a user terminal, and a method for performing a function in the user terminal. The refrigerator according to the present disclosure may include: a storage chamber storing food therein; a temperature detection unit configured to detect the internal temperature of the storage chamber; a cooling unit configured to supply cold air to the storage chamber; a camera configured to photograph food in the storage chamber; a communication unit configured to communicate with a user terminal; a display; at least one processor electrically connected to the temperature detection unit, the camera, the cooling unit, and the communication unit; and a memory electrically connected to the at least one processor.
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3.发明申请公开(公告)号：US20150155140A1
公开(公告)日：2015-06-04
申请号：US14543897
申请日：2014-11-18
Applicant: Samsung Electronics Co., Ltd.
Inventor： Ju-hee Lee , Su-ho Lee , Won-hyuk Jang , Jae-beom Park , Ik-soo Kim , Myoung-woon Kim
CPC classification number: H01J37/3288 , H01J37/32577 , H01J37/32908
Abstract: A semiconductor manufacturing apparatus may include a chamber accommodating a substrate to be processed, a first electrode providing electric field in the chamber and a second electrode opposing to the first electrode, and a first power transmitting rod connected to one of the first electrode and the second electrode. A conductive stress attenuating unit may be formed in the first power transmitting rod. Methods of manufacturing semiconductor devices using the semiconductor manufacturing apparatus are also disclosed.
Abstract translation: 半导体制造装置可以包括容纳要处理的基板的腔室，在腔室中提供电场的第一电极和与第一电极相对的第二电极，以及连接到第一电极和第二电极之一的第一电力传输杆 电极。 可以在第一动力传递杆中形成导电应力衰减单元。 还公开了使用半导体制造装置制造半导体器件的方法。
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