公开(公告)号：US20180233458A1

公开(公告)日：2018-08-16

申请号：US15949286

申请日：2018-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-hee JEONG ,  Soo-jae PARK ,  Young-hoon KIM ,  In-ku KANG ,  Hee-yeol KIM

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16237 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.

公开(公告)号：US20180090449A1

公开(公告)日：2018-03-29

申请号：US15604762

申请日：2017-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-hee JEONG ,  Soo-jae PARK ,  Young-hoon KIM ,  In-ku KANG ,  Hee-yeol KIM

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16237 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.