公开(公告)号：US20170280560A1

公开(公告)日：2017-09-28

申请号：US15465574

申请日：2017-03-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo-jae PARK

IPC: H05K1/11 ,  H05K1/18

Abstract: A printed circuit board (PCB) having a reliable electrical connection with connection terminals and a semiconductor package including the PCB, the printed circuit board including: a substrate base; a plurality of pads disposed on upper and lower surfaces of the substrate base; and a solder resist layer configured to cover at least a portion of the upper and lower surfaces of the substrate base, wherein at least some of the plurality of pads are groove pads comprising at least one annular groove in a side opposite to the substrate base.

公开(公告)号：US20180233458A1

公开(公告)日：2018-08-16

申请号：US15949286

申请日：2018-04-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-hee JEONG ,  Soo-jae PARK ,  Young-hoon KIM ,  In-ku KANG ,  Hee-yeol KIM

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/065 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16237 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.

公开(公告)号：US20180247887A1

公开(公告)日：2018-08-30

申请号：US15803831

申请日：2017-11-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Soo-jae PARK ,  Moon-gi CHO

IPC: H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L23/31

Abstract: A printed circuit board (PCB) is provided as follows. A first connection pad and a second connection pad are disposed on a first surface and a second surface of the base substrate layer, respectively. The first connection pad and the second connection pad each includes a first metal. A first pad cover layer covers a top surface of the first connection pad and includes an insulating metal oxide having a second metal different from the first metal.

公开(公告)号：US20180090449A1

公开(公告)日：2018-03-29

申请号：US15604762

申请日：2017-05-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Chan-hee JEONG ,  Soo-jae PARK ,  Young-hoon KIM ,  In-ku KANG ,  Hee-yeol KIM

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065

CPC classification number: H01L23/552 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49811 ,  H01L23/49838 ,  H01L24/16 ,  H01L25/0655 ,  H01L25/18 ,  H01L2224/16237 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: An integrated circuit package includes at least one first chip mounted in a first region of a mounting surface of a printed circuit board, a molding unit covering the mounting surface and surrounding the at least one first chip, an electromagnetic shielding film covering a surface of the molding unit and surrounding the at least one first chip, and a second chip mounted in a second region of the mounting surface. The second chip is exposed outside the electromagnetic shielding film and is spaced apart from the printed circuit board, with the molding unit being between the second chip and the printed circuit board.