公开(公告)号：US20240312974A1

公开(公告)日：2024-09-19

申请号：US18497672

申请日：2023-10-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： KYOUNGLIM SUK ,  JIHWANG KIM ,  SUCHANG LEE ,  JAEGWON JANG

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H10B80/00

CPC classification number: H01L25/18 ,  H01L23/3107 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/08 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H10B80/00 ,  H01L23/49866 ,  H01L2224/08145 ,  H01L2224/16148 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1438 ,  H01L2924/3511

Abstract: A semiconductor package includes a lower redistribution structure including a lower redistribution layer, a lower chip structure disposed on the lower redistribution structure, a plurality of posts disposed around the lower chip structure and including a lower metal layer on the lower redistribution layer and an upper metal layer on the lower metal layer, an encapsulant covering respective side surfaces of the lower chip structure and the plurality of posts, a heat dissipation member disposed on the encapsulant and vertically overlapping at least a portion of the lower chip structure, an upper chip structure disposed on one side of the heat dissipation member and vertically overlapping at least a portion of the plurality of posts, and electrically connected to the lower redistribution layer through the plurality of posts, and external connection bumps disposed below the lower redistribution structure. The lower metal layer and the upper metal layer include different metals.