公开(公告)号：US20240312959A1

公开(公告)日：2024-09-19

申请号：US18675679

申请日：2024-05-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DOOHWAN LEE ,  JUNGSOO BYUN

IPC: H01L25/065 ,  H01L23/00 ,  H01L23/04 ,  H01L23/31 ,  H01L23/538

CPC classification number: H01L25/0657 ,  H01L23/041 ,  H01L23/3128 ,  H01L23/5383 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/73203 ,  H01L2225/06562

Abstract: A semiconductor package includes a frame having a through-opening, a first semiconductor chip disposed in the through-opening and having a first active surface on which a first connection pad is disposed and a first inactive surface opposing the first active surface, a second semiconductor chip disposed on the first semiconductor chip and having a second active surface on which a second connection pad is disposed and a second inactive surface opposing the second active surface, first and second bumps electrically connected to the first and second connection pads, respectively, first and second dummy bumps disposed on a same level as levels of the first and second bumps, respectively, first and second posts electrically connected to the first and second bumps, respectively, a connection member including a redistribution layer electrically connected to each of the first and second posts, and a dummy post disposed between the frame and the connection member.

公开(公告)号：US20220181303A1

公开(公告)日：2022-06-09

申请号：US17679861

申请日：2022-02-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DOOHWAN LEE ,  JUNGSOO BYUN

IPC: H01L25/065 ,  H01L23/04 ,  H01L23/00 ,  H01L23/538 ,  H01L23/31

Abstract: A semiconductor package includes a frame having a through-opening, a first semiconductor chip disposed in the through-opening and having a first active surface on which a first connection pad is disposed and a first inactive surface opposing the first active surface, a second semiconductor chip disposed on the first semiconductor chip and having a second active surface on which a second connection pad is disposed and a second inactive surface opposing the second active surface, first and second bumps electrically connected to the first and second connection pads, respectively, first and second dummy bumps disposed on a same level as levels of the first and second bumps, respectively, first and second posts electrically connected to the first and second bumps, respectively, a connection member including a redistribution layer electrically connected to each of the first and second posts, and a dummy post disposed between the frame and the connection member.