公开(公告)号：US20210407923A1

公开(公告)日：2021-12-30

申请号：US17167789

申请日：2021-02-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： DONGHO KIM ,  JONGBO SHIM ,  HWAN PIL PARK ,  CHOONGBIN YIM ,  JUNGWOO KIM

IPC: H01L23/538 ,  H01L23/13 ,  H01L23/31 ,  H01L23/00 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package substrate includes a substrate having a bottom surface including a cavity structure defined therein. The cavity structure includes a floor surface. A passive device structure has at least a partial portion of the passive device structure disposed in the cavity structure. The passive device structure includes a first passive device and a second passive device that are each electrically connected to the floor surface of the cavity structure. At least partial portions of the first passive device and the second passive device vertically overlap each other.