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公开(公告)号:US11476287B2
公开(公告)日:2022-10-18
申请号:US16928263
申请日:2020-07-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Gwi Deok Ryan Lee , Jae Kyu Lee , Sang Chun Park , Tae Yon Lee , Jae Hoon Jeon , Myung Lae Chu
IPC: H01L27/146 , H01L21/00 , H01L27/30 , H01L29/786 , H04N5/369
Abstract: An image sensor may include a substrate having a first surface and a second surface on opposite sides, a first transistor having a first gate disposed on the first surface, a photoelectric conversion layer which generates photocharges from light incident in a first direction, a second transistor having a transistor structure disposed between the first surface and the photoelectric conversion layer and spaced from the photoelectric conversion layer, and includes a semiconductor layer composed of a metal oxide semiconductor material. The semiconductor layer may have a third surface facing the first direction and a fourth surface opposite the third surface, with a second gate disposed on the semiconductor layer. The semiconductor layer may be connected to the first gate. A light blocking layer may be disposed between the third surface and the photoelectric conversion layer, and spaced from the photoelectric conversion layer.
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公开(公告)号:US11855115B2
公开(公告)日:2023-12-26
申请号:US17315589
申请日:2021-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: KangMook Lim , Dae Hoon Kim , Seung Sik Kim , Ji-Youn Song , Jae Hoon Jeon , Dong Seok Cho
IPC: H01L27/146
CPC classification number: H01L27/14636 , H01L27/14603 , H01L27/14621 , H01L27/14627
Abstract: An image sensor includes a plurality of unit pixels, each including: a substrate including first and second sides which are opposite to each other, a photoelectric conversion layer in the substrate, and a wiring structure on the first side of the substrate. The wiring structure may include: a first capacitor, a second capacitor spaced from the first capacitor, a plurality of edge vias arranged along edges of the unit pixel, and a plurality of central vias interposed between the first capacitor and the second capacitor.
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公开(公告)号:US20220077216A1
公开(公告)日:2022-03-10
申请号:US17315589
申请日:2021-05-10
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: KangMook Lim , Dae Hoon Kim , Seung Sik Kim , Ji-Youn Song , Jae Hoon Jeon , Dong Seok Cho
IPC: H01L27/146
Abstract: An image sensor includes a plurality of unit pixels, each including: a substrate including first and second sides which are opposite to each other, a photoelectric conversion layer in the substrate, and a wiring structure on the first side of the substrate. The wiring structure may include: a first capacitor, a second capacitor spaced from the first capacitor, a plurality of edge vias arranged along edges of the unit pixel, and a plurality of central vias interposed between the first capacitor and the second capacitor.
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公开(公告)号:US20230057857A1
公开(公告)日:2023-02-23
申请号:US17872056
申请日:2022-07-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Kang Mook Lim , Seung Sik Kim , Jae Hoon Jeon , Je Yeoun Jung
IPC: H01L27/146
Abstract: An image sensor includes: a substrate including a first area and a second area; a plurality of unit pixels disposed in the substrate, wherein each of the plurality of unit pixels includes a photoelectric conversion layer; a pixel defining pattern separating the unit pixels from each other; a surface insulating film disposed on the substrate; a line structure disposed on the substrate, and including a first interline insulating film and a wire pattern disposed in the first interline insulating film; a micro-lens disposed in the first area; and a light-blocking film disposed in the second area. The light-blocking film includes: a horizontal light-blocking film extending along a top surface of the surface insulating film; and a vertical light-blocking film extending through the surface insulating film and the substrate. The vertical light-blocking film is electrically connected to the wire pattern. The light-blocking film is electrically connected to the pixel defining pattern.
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