公开(公告)号：US20240153863A1

公开(公告)日：2024-05-09

申请号：US18219211

申请日：2023-07-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kyoungok JUNG ,  Jakyoung GU

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L23/49866 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/5383 ,  H01L25/0652 ,  H01L25/105 ,  H10B80/00 ,  H01L24/16 ,  H01L2224/16225

Abstract: A semiconductor package including, a first redistribution substrate including a first body layer and a first wiring layer in the first body layer, a semiconductor chip on the first redistribution substrate, a through post around the semiconductor chip and on the first redistribution substrate, and a second redistribution substrate on the semiconductor chip and the through post, wherein, the first wiring layer includes a first titanium seed layer, and the first titanium seed layer has a vertical cross-section of a trapezoid structure in which a top surface is narrow and a bottom surface is wide.

公开(公告)号：US20240038549A1

公开(公告)日：2024-02-01

申请号：US18125958

申请日：2023-03-24

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jakyoung GU ,  Minsoo KIM ,  Jihye SHIM ,  Kyoungok JUNG

IPC: H01L21/48 ,  H01L25/10 ,  H10B80/00

CPC classification number: H01L21/4857 ,  H01L25/105 ,  H10B80/00 ,  H01L2225/1035 ,  H01L24/16

Abstract: A method of manufacturing a semiconductor package includes forming a plurality of conductive patterns on a substrate, forming a photoresist film over the substrate to cover the plurality of conductive patterns, forming a photoresist pattern from the photoresist film by a photolithography process using a photomask that includes a transparent area, a light-shielding area, and a semi-transparent area transmitting only a portion of light incident thereon, wherein the photoresist pattern includes a via hole, which exposes one conductive pattern, and a recessed portion, which has a lower surface exposing a portion of the photoresist pattern, forming a conductive post in the via hole, and removing the photoresist pattern by using a photoresist stripping composition.