公开(公告)号：US20170287814A1

公开(公告)日：2017-10-05

申请号：US15479856

申请日：2017-04-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-woo KIM ,  Jae-min JUNG ,  Ji-yong PARK ,  Jeong-kyu HA ,  Woon-bae KIM

IPC: H01L23/498 ,  H01L23/29 ,  H01L23/00

CPC classification number: H01L23/4985 ,  H01L23/29 ,  H01L23/488 ,  H01L23/4922 ,  H01L24/29 ,  H01L24/32 ,  H01L25/167 ,  H01L33/48 ,  H01L33/62 ,  H01L2924/143 ,  H01L2924/186

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.