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    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
    2.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE 有权

    公开(公告)号：US20220359439A1

    公开(公告)日：2022-11-10

    申请号：US17564689

    申请日：2021-12-29

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Eunsu LEE ,  Dongho KIM ,  Jiyong PARK ,  Jeonghyun LEE

    IPC: H01L23/00 ,  H01L23/48 ,  H01L25/065

    Abstract: A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a desired depth in the first substrate from a second surface of the first substrate and exposing an end portion of the first through electrode, and a second bonding pad in the first recess and electrically connected to the first through electrode, a second semiconductor chip stacked on the second surface of the first substrate and including a third bonding pad on a third surface of a second substrate, and a conductive connection member between the second bonding pad and the third bonding pad. At least a portion of the conductive connection member may be in the first recess.

    REFRIGERATOR
    4.
    发明申请
    REFRIGERATOR 有权

    公开(公告)号：US20210238900A1

    公开(公告)日：2021-08-05

    申请号：US17161208

    申请日：2021-01-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taecheol PARK ,  Byoungmok KIM ,  Jeonghyun LEE ,  Seokjun SON

    IPC: E05D7/00 ,  F25D23/02 ,  E05D3/02

    Abstract: Disclosed is a refrigerator with a storage space. The refrigerator includes a main body including a storage space, a door configured to open and close the storage space, and a hinge provided under the door and configured to rotatably couple the door to the main body. The hinge includes a linear member accommodator configured to accommodate therein a linear member drawn out from the door, and a cut-out portion hollowed and configured to extend along a hinge axial direction to allow the linear member accommodator to communicate with an outside at one side.

    SEMICONDUCTOR PACKAGE INCLUDING A SUPPORT SOLDER BALL
    5.
    发明申请
    SEMICONDUCTOR PACKAGE INCLUDING A SUPPORT SOLDER BALL 有权

    公开(公告)号：US20220352058A1

    公开(公告)日：2022-11-03

    申请号：US17555583

    申请日：2021-12-20

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Jeonghyun LEE ,  Dongwook KIM ,  Hwan Pil PARK ,  Jongbo SHIM

    IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L23/16

    Abstract: A semiconductor package including: a first substrate; a first semiconductor device on the first substrate; a first mold layer covering the first semiconductor device; a second substrate on the first mold layer; a support solder ball interposed between the first substrate and the second substrate, and electrically disconnected from the first substrate or the second substrate, wherein the support solder ball includes a core and is disposed near a first sidewall of the first semiconductor device; and a substrate connection solder ball disposed between the first sidewall of the first semiconductor device and the support solder ball to electrically connect the first substrate to the second substrate, wherein a top surface of the first semiconductor device has a first height from a top surface of the first substrate, and the core has a second height which is equal to or greater than the first height.

    REFRIGERATOR
    6.
    发明申请
    REFRIGERATOR 有权

    公开(公告)号：US20220268510A1

    公开(公告)日：2022-08-25

    申请号：US17744330

    申请日：2022-05-13

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Chanbin PARK ,  Yang-Yeol GU ,  Jaejin LEE ,  Jeonghyun LEE

    IPC: F25D23/02 ,  E05B65/00

    Abstract: A refrigerator with an enhanced door includes a main body including a storeroom, first and second doors pivotally coupled to the main body to open or close the storeroom and a pivot bar pivotally installed at the first door. The pivot bar is movable between a first position between the first and second doors and a second position pivoted toward the first door to prevent cold air leaks from the storeroom. A locking device separably locks the pivot bar to the first door when the pivot bar is in the second position.

    ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF
    7.
    发明申请
    ELECTRONIC APPARATUS AND CONTROLLING METHOD THEREOF 有权

    公开(公告)号：US20210396452A1

    公开(公告)日：2021-12-23

    申请号：US17225576

    申请日：2021-04-08

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Taecheol PARK ,  Byoungmok KIM ,  Jonghyun SON ,  Jeonghyun LEE ,  Seokjun SON

    IPC: F25D23/02 ,  H05B47/115 ,  G01S7/48

    Abstract: A refrigerator is provided. The refrigerator includes a main body including a first door, a door opening device configured to open the first door, a first proximity sensor disposed adjacent to the first door, a first infrared sensor disposed on the first door, and at least one processor, wherein the at least one processor is configured to, based on detection data obtained by the first proximity sensor, control the door opening device to open the first door based on an external object approaching within a threshold distance from the refrigerator, and based on the external object being identified based on detection data obtained by the first infrared sensor while the first door is open, control the door opening device to stop opening of the first door.

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