公开(公告)号：US10985310B2

公开(公告)日：2021-04-20

申请号：US16265169

申请日：2019-02-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Park ,  Woo-seok Chin ,  Ji-yeon Jung

IPC: H01L41/08 ,  G06F3/041 ,  G06F1/16 ,  G06F3/01 ,  H01L41/04 ,  H01L41/09 ,  G02F1/1333

Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.

公开(公告)号：US09818928B2

公开(公告)日：2017-11-14

申请号：US13974770

申请日：2013-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Park ,  Woo-seok Chin ,  Ji-yeon Jung

IPC: G06F3/01 ,  G06F3/041 ,  H01L41/08 ,  H01L41/04 ,  G06F1/16 ,  H01L41/09 ,  G02F1/1333

CPC classification number: H01L41/0825 ,  G02F1/133305 ,  G06F1/1652 ,  G06F3/016 ,  G06F3/0412 ,  H01L41/042 ,  H01L41/0926

Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.

公开(公告)号：US10230039B2

公开(公告)日：2019-03-12

申请号：US15784565

申请日：2017-10-16

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jin Park ,  Woo-seok Chin ,  Ji-yeon Jung

IPC: H01L41/08 ,  G06F1/16 ,  G06F3/01 ,  G06F3/041 ,  H01L41/04 ,  G02F1/1333 ,  H01L41/09

Abstract: A flexible device includes a flexible body and a plurality of piezoelectric materials arranged on the flexible body that deform in response to drive signals causing deformation of the flexible body of the flexible device.